Patents by Inventor Ehood Geva

Ehood Geva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7257001
    Abstract: A method and an assembly of the invention are intended for connecting two parts via a spacer made from a heat-shrinkable material shrinkable only in one direction. The spacer is sandwiched between the parts and attached to both parts with such orientation that direction of the shrinkage of the spacer coincides with the direction of movement of both parts towards each other. After the parts and the spacer are interconnected, the spacer is heated for causing said parts to move closer to each other. The space between the parts can be filled with an adhesive material so that the parts will be held together without the use of clamps or binding bands while the adhesive is cured. Another application is to attach a heatsink to an electronic device supported by a PC board. Shrinkage of the spacer under effect of heating brings the electronic device into a tight heat-transferring contact with the heatsink and maintains this contact irreversibly.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: August 14, 2007
    Inventors: Shmuel Erez, Ehood Geva
  • Patent number: 7186924
    Abstract: A trace cover suitable for shielding a conductive trace on a top layer of a circuit board. The trace cover includes a dielectric body disposed substantially over the conductive trace, side shielding perpendicular to the direction of the conductive trace and substantially parallel to the length of the conductive trace, and top shielding disposed on the top surface of the body. The side shielding and top shielding are electrically coupled with the at least one circuit ground of the circuit board.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: March 6, 2007
    Assignee: International Business Machines Corporation
    Inventors: Ehood Geva, Todd E. Takken
  • Publication number: 20060135305
    Abstract: The present invention is a harmonic belt drive that uniquely combines desirable characteristics of a traditional harmonic drive with those of a traditional belt drive. The harmonic belt drive includes a rigid arcuate toothed member having an internal surface, an external surface, and a row of teeth radially extending from the internal surface and a belt portal extending between the internal surface and external surface. A multi-lobe cam is rotatably mounted concentric within the rigid toothed member and an elongated toothed belt is disposable between the multi-lobe cam and rigid arcuate toothed member. The toothed belt is radially deflectable by the multi-lobe cam meshing an area of belt teeth with an area of arcuate member teeth. The toothed belt advances by a small amount with each revolution of the multi-lobe cam.
    Type: Application
    Filed: December 13, 2004
    Publication date: June 22, 2006
    Inventors: Shmuel Erez, Ehood Geva
  • Publication number: 20050235487
    Abstract: A method and an assembly of the invention are intended for connecting two parts via a spacer made from a heat-shrinkable material shrinkable only in one direction. The spacer is sandwiched between the parts and attached to both parts with such orientation that direction of the shrinkage of the spacer coincides with the direction of movement of both parts towards each other. After the parts and the spacer are interconnected, the spacer is heated for causing said parts to move closer to each other. The space between the parts can be filled with an adhesive material so that the parts will be held together without the use of clamps or binding bands while the adhesive is cured. Another application is to attach a heatsink to an electronic device supported by a PC board. Shrinkage of the spacer under effect of heating brings the electronic device into a tight heat-transferring contact with the heatsink and maintains this contact irreversibly.
    Type: Application
    Filed: April 23, 2004
    Publication date: October 27, 2005
    Inventors: Shmuel Erez, Ehood Geva
  • Publication number: 20050082087
    Abstract: A trace cover suitable for shielding a conductive trace on a top layer of a circuit board. The trace cover includes a dielectric body disposed substantially over the conductive trace, side shielding perpendicular to the direction of the conductive trace and substantially parallel to the length of the conductive trace, and top shielding disposed on the top surface of the body. The side shielding and top shielding are electrically coupled with the at least one circuit ground of the circuit board.
    Type: Application
    Filed: October 21, 2003
    Publication date: April 21, 2005
    Inventors: Ehood Geva, Todd Takken
  • Patent number: 6707676
    Abstract: The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: March 16, 2004
    Inventors: Ehood Geva, Shmuel Erez
  • Publication number: 20040042177
    Abstract: The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 4, 2004
    Inventors: Ehood Geva, Shmuel Erez
  • Publication number: 20020046944
    Abstract: A sputter deposition chamber may be fitted with measures to prevent or reduce electrical noise that might otherwise interfere with a controller for the sputter deposition chamber. A grounded shield plate may be coupled to an insulating member by which a sputtering target is mounted in the chamber. A ground line, separate from a power supply line, may be coupled to the chamber's enclosure wall and to a varying power supply. One or more filters may be coupled in series between chamber components and a controller associated with the chamber.
    Type: Application
    Filed: June 27, 2001
    Publication date: April 25, 2002
    Inventor: Ehood Geva