Patents by Inventor Ehsan Foroozanfard

Ehsan Foroozanfard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12332371
    Abstract: A radar device comprising: a printed circuit board (120), PCB, comprising a ground plane (1202), a radar sensor chip package (130) mounted on the PCB (120) and comprising a mm Wave radio frequency, RF, integrated circuit (1302) and a planar antenna structure (1304) configured as an antenna-in-package and oriented in a plane parallel to the ground plane (1202), wherein the mmWave RF integrated circuit (1302) is configured to output a mmWave signal (1360) to be transmitted by the planar antenna structure (1304), and a cavity (140), wherein the radar sensor chip package (130) is arranged in the cavity (140), the cavity (140) having an open side (1402), and the cavity (140) being defined by a conductive rear wall surface (1404) opposite the open side (1402), a pair of mutually opposite and conductive sidewall surfaces (1406), a conductive top surface (1408), and a conductive bottom surface (1410), wherein at least a portion of the conductive bottom surface (1410) is formed by at least a portion of the ground plan
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: June 17, 2025
    Assignee: Acconeer AB
    Inventors: Ehsan Foroozanfard, Mikael Egard
  • Publication number: 20230228843
    Abstract: A radar device comprising: a printed circuit board (120), PCB, comprising a ground plane (1202), a radar sensor chip package (130) mounted on the PCB (120) and comprising a mm Wave radio frequency, RF, integrated circuit (1302) and a planar antenna structure (1304) configured as an antenna-in-package and oriented in a plane parallel to the ground plane (1202), wherein the mmWave RF integrated circuit (1302) is configured to output a mmWave signal (1360) to be transmitted by the planar antenna structure (1304), and a cavity (140), wherein the radar sensor chip package (130) is arranged in the cavity (140), the cavity (140) having an open side (1402), and the cavity (140) being defined by a conductive rear wall surface (1404) opposite the open side (1402), a pair of mutually opposite and conductive sidewall surfaces (1406), a conductive top surface (1408), and a conductive bottom surface (1410), wherein at least a portion of the conductive bottom surface (1410) is formed by at least a portion of the ground plan
    Type: Application
    Filed: June 8, 2021
    Publication date: July 20, 2023
    Applicant: Acconeer AB
    Inventors: Ehsan Foroozanfard, Mikael Egard