Patents by Inventor Eichiro Okumura

Eichiro Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOVEMENT MECHANISM AND RACK HOUSING STRUCTURE
    Publication number: 20140319985
    Abstract: A movement mechanism includes: a guide member; an installation base that is movably provided on the guide member; and a removable cover base that is removably disposed, next to the installation base, on the guide member.
    Type: Application
    Filed: April 3, 2014
    Publication date: October 30, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Akira KIKUCHI, Eichiro OKUMURA, Akihiro HAMAGUCHI, Akira MINEGISHI
  • Fixing member for fixing blindfold plate and method of fixing blindfold plate
    Patent number: 8520404
    Abstract: A fixing member for fixing a blindfold plate to a support post where a fixing hole is formed, the fixing member includes: a deformation portion that is attached to the blindfold plate, and is inserted in to the fixing hole while being deformed and stays in the fixing hole in a deformed condition when the blindfold plate is fixed to the support post.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: August 27, 2013
    Assignee: Fujitsu Limited
    Inventors: Akihiro Hamaguchi, Eichiro Okumura, Akira Kikuchi
  • FIXING MEMBER FOR FIXING BLINDFOLD PLATE AND METHOD OF FIXING BLINDFOLD PLATE
    Publication number: 20110286196
    Abstract: A fixing member for fixing a blindfold plate to a support post where a fixing hole is formed, the fixing member includes: a deformation portion that is attached to the blindfold plate, and is inserted in to the fixing hole while being deformed and stays in the fixing hole in a deformed condition when the blindfold plate is fixed to the support post.
    Type: Application
    Filed: August 3, 2011
    Publication date: November 24, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Akihiro HAMAGUCHI, Eichiro Okumura, Akira Kikuchi
  • Apparatus, mounting structure, inserting and pulling jig, and fixing method
    Patent number: 8007299
    Abstract: An apparatus includes a first substrate, a first connector disposed on a top face of the first substrate, a to-be-fixed member disposed on a back face of the first substrate, a second substrate disposed facing the first substrate, a second connector disposed on the second substrate and connected to the first connector, and a fixing module disposed on the second substrate and pivoting a locking arm using a rotating shaft, wherein the to-be-fixed member is pushed by a pushing portion provided at a tip of the locking arm when the locking arm is at a first position.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: August 30, 2011
    Assignee: Fujitsu Limited
    Inventors: Hajime Murakami, Yoshinori Uzuka, Eichiro Okumura, Takeshi Nishiyama, Tatsuya Akashi
  • APPARATUS, MOUNTING STRUCTURE, INSERTING AND PULLING JIG, AND FIXING METHOD
    Publication number: 20100240241
    Abstract: An apparatus includes a first substrate, a first connector disposed on a top face of the first substrate, a to-be-fixed member disposed on a back face of the first substrate, a second substrate disposed facing the first substrate, a second connector disposed on the second substrate and connected to the first connector, and a fixing module disposed on the second substrate and pivoting a locking arm using a rotating shaft, wherein the to-be-fixed member is pushed by a pushing portion provided at a tip of the locking arm when the locking arm is at a first position.
    Type: Application
    Filed: April 26, 2010
    Publication date: September 23, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Hajime MURAKAMI, Yoshinori UZUKA, Eichiro OKUMURA, Takeshi NISHIYAMA, Tatsuya AKASHI
  • Electronic apparatus mounting structure
    Patent number: 4719541
    Abstract: The present invention relates to a mounting structure for electronic apparatus mounting electronic parts with a high mounting density. The present invention is capable of supplying power to a printed wiring board from a power supply without a voltage drop through a very short wiring distance. Both the power supply and printed wiring board are cooled with a common air cooling fan, and the power supply, bus plate and printed wiring board are integrally assembled and connected.
    Type: Grant
    Filed: October 10, 1986
    Date of Patent: January 12, 1988
    Assignee: Fujitsu Limited
    Inventors: Izumi Ono, Haruo Takayama, Yasuo Takahashi, Eichiro Okumura