Patents by Inventor Eietsu ABE

Eietsu ABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component
    Patent number: 12131862
    Abstract: An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: October 29, 2024
    Assignee: TDK CORPORATION
    Inventors: Kyosuke Inui, Makoto Morita, Takashi Kudo, Toshiyuki Anbo, Kyohei Tonoyama, Fuyuki Miura, Masanori Sugai, Eietsu Abe, Toru Tonogai, Yuichi Oyanagi
  • Coil device
    Patent number: 12119154
    Abstract: The present invention provides a coil device which includes two coil elements in the same device and achieves an improved wire occupancy. The coil device includes a core including a winding core, and a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein the winding wire part includes a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer, and a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: October 15, 2024
    Assignees: TDK CORPORATION, TDK KOREA CORPORATION
    Inventors: Kiyofumi Fujiwara, Hiroyuki Iwata, Eietsu Abe, Sepung Ki, Chihu An
  • ELECTRONIC COMPONENT
    Publication number: 20210358683
    Abstract: An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 18, 2021
    Applicant: TDK CORPORATION
    Inventors: Kyosuke INUI, Makoto MORITA, Takashi KUDO, Toshiyuki ANBO, Kyohei TONOYAMA, Fuyuki MIURA, Masanori SUGAI, Eietsu ABE, Toru TONOGAI, Yuichi OYANAGI
  • COIL DEVICE
    Publication number: 20210304943
    Abstract: The present invention provides a coil device which includes two coil elements in the same device and achieves an improved wire occupancy. The coil device includes a core including a winding core, and a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein the winding wire part includes a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer, and a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Applicants: TDK CORPORATION, TDK KOREA CORPORATION
    Inventors: Kiyofumi FUJIWARA, Hiroyuki IWATA, Eietsu ABE, Sepung KI, Chihu AN