Patents by Inventor Eietsu Hasegawa

Eietsu Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of recovering lead-free solder from printed circuit boards
    Patent number: 6705509
    Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: March 16, 2004
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Sakari Tada, Eietsu Hasegawa
  • Method of recovering lead-free solder from printed circuit boards
    Publication number: 20030178470
    Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.
    Type: Application
    Filed: March 22, 2002
    Publication date: September 25, 2003
    Inventors: Sakari Tada, Eietsu Hasegawa
  • Soldering method using a Cu-containing lead-free alloy
    Patent number: 6474537
    Abstract: Members to be soldered, such as printed circuit boards having electronic parts mounted thereon, are subjected to flow soldering in a solder bath with a Cu-containing lead-free solder. When the molten solder in the solder bath falls below a prescribed level, the molten solder is replenished with a material having a lower Cu content than the initial composition of the solder bath. Flow soldering can be continued for long periods with the Cu content of the solder bath being maintained substantially constant.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: November 5, 2002
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Seiichiro Hasegawa, Eietsu Hasegawa
  • Solder paste for electronic parts
    Patent number: 4740252
    Abstract: A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.
    Type: Grant
    Filed: February 2, 1987
    Date of Patent: April 26, 1988
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Eietsu Hasegawa, Rikiya Kato