Patents by Inventor Eigi Fujii

Eigi Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitor for integrated circuit and its fabrication method
    Patent number: 6214660
    Abstract: A method for fabricating a capacitor for an integrated circuit, comprising the steps of forming a titanium film for an adhesion layer over a substrate, forming a titanium dioxide film for a diffusion barrier layer by annealing the titanium film after ion-implantation of oxygen ion into a surface region of the titanium film so as to change titanium in the surface region to titanium dioxide, and forming a high dielectric constant capacitor on the titanium dioxide film.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: April 10, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Yasuhiro Uemoto, Eigi Fujii, Koji Arita, Yoshihisa Nagano, Yasuhiro Shimada, Masamichi Azuma, Atsuo Inoue, Yasufumi Izutsu
  • Capacitor for integrated circuit and its fabrication method
    Patent number: 5929475
    Abstract: A method for fabricating a capacitor for an integrated circuit, comprising the steps of forming a titanium film for an adhesion layer over a substrate, forming a titanium dioxide film for a diffusion barrier layer by annealing the titanium film after ion-implantation of oxygen ion into a surface region of the titanium film so as to change titanium in the surface region to titanium dioxide, and forming a high dielectric constant capacitor on the titanium dioxide film.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: July 27, 1999
    Inventors: Yasuhiro Uemoto, Eigi Fujii, Koji Arita, Yoshihisa Nagano, Yasuhiro Shimada, Masamichi Azuma, Atsuo Inoue, Yasufumi Izutsu