Patents by Inventor Eigo Inagaki

Eigo Inagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120008288
    Abstract: Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions.
    Type: Application
    Filed: May 17, 2011
    Publication date: January 12, 2012
    Applicant: Sony Corportation
    Inventors: Sotaro Tsukamoto, Eigo Inagaki