Patents by Inventor Eigo Sarashina

Eigo Sarashina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7885718
    Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: February 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Publication number: 20090259333
    Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
    Type: Application
    Filed: April 9, 2009
    Publication date: October 15, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Toshio YANO, Hiroshi OKAMURA, Yoshihiko MISAWA, Yoshinori ISOBATA, Ken TAKAHASHI, Masuo MASUI, Eigo SARASHINA, Akira IIZUKA
  • Patent number: 7536236
    Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: May 19, 2009
    Assignee: Panasonic Corporation
    Inventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Patent number: 7142939
    Abstract: A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: November 28, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Publication number: 20060136787
    Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.
    Type: Application
    Filed: January 30, 2006
    Publication date: June 22, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Publication number: 20060136786
    Abstract: A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.
    Type: Application
    Filed: January 30, 2006
    Publication date: June 22, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Publication number: 20040153868
    Abstract: A service receiving device (1) is provided for a production facility (151, 108, 108a, 108b, 100) such as a component mounting apparatus on the user side, whereas a service providing device (2) is provided for the manufacturer side providing the production facility. These service receiving device (1) and service providing device (2) communicate with each other in a mutual manner or from a necessary side to the other side through various communication systems including the Internet line owing to a software (161, 161a), so that a service relating to response to a trouble or production including the productivity or the quality maintenance is derived or transmitted according to need.
    Type: Application
    Filed: July 10, 2003
    Publication date: August 5, 2004
    Inventors: Satoshi Nonaka, Hitoshi Nakamura, Yoshiyuki Hattori, Toshio Yano, Hiroshi Okamura, Yoshihiko Misawa, Yoshinori Isobata, Ken Takahashi, Masuo Masui, Eigo Sarashina, Akira Iizuka
  • Patent number: 6217669
    Abstract: In a printing device in which a printing material is printed on or applied to a to-be-printed surface of a circuit board through a screen mask for printing having openings formed therein in a predetermined pattern, it is intended to reliably remove cream solder remaining in the openings in the screen mask. After an air suction mechanism (19) has its flow rate controlled by a flow rate controller (20). An air suction section (15) is lifted until its front end contacts with the screen mask (5), the air suction mechanism (19) starts cleaning by sucking air from the openings (6) in the screen mask (5). An inspecting camera (2) is used to observe the cream solder (4) remaining in the openings (6) after cleaning, and the air suction flow rate is controlled according to the results thereof to effect cleaning again.
    Type: Grant
    Filed: October 6, 1998
    Date of Patent: April 17, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eigo Sarashina, Ken Takahashi, Masuo Masui, Takao Naito
  • Patent number: 5948466
    Abstract: An engraved recess (4) is formed in a resin stencil (1) at a position on a surface of the resin stencil where the resin stencil, when registered with a circuit board, agrees with a fiducial mark of the circuit board. The recess is formed by a laser (3) and serves as a fiducial mark.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: September 7, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eigo Sarashina, Yousuke Nagasawa, Ken Takahashi, Takao Naito