Abstract: A polishing apparatus includes a belt-type surface plate stretched between two rollers each having a rotation shaft arranged in parallel to that of the other roller, a plurality of sheet-type polishing pads stuck on the surface plate, and a dresser for activating the polishing pads. Part of an upper end portion of each of the polishing pads facing an adjacent one of the polishing pads has an obtuse angle. Thus, the dresser is not caught by the upper end portion of each of the polishing pads, so that the generation of a scratch in the polishing pads. Therefore, a semiconductor wafer can be polished without causing a scratch thereon.

Abstract: A polishing apparatus includes a belt-type surface plate stretched between two rollers each having a rotation shaft arranged in parallel to that of the other roller, a plurality of sheet-type polishing pads stuck on the surface plate, and a dresser for activating the polishing pads. Part of an upper end portion of each of the polishing pads facing an adjacent one of the polishing pads has an obtuse angle. Thus, the dresser is not caught by the upper end portion of each of the polishing pads, so that the generation of a scratch in the polishing pads. Therefore, a semiconductor wafer can be polished without causing a scratch thereon.

Abstract: A method for fabricating a semiconductor device, which includes the process step of polishing a substrate using CMP. To suppress the generation of scars and scratches on a wafer surface, in the polishing process, a tube-type slurry supply pump 15 is used to supply slurry. Then, in the tube-type slurry supply pump 15, a vinyl chloride type tube is used as a tube 12 for supplying a slurry.

Abstract: On the surface of a belt-type surface plate wound around two rollers whose rotation axes are arranged in parallel with each other, four or other number of sheet-shaped polishing pads of polyurethane are stuck. Each of the polishing pads has grooves extending in the same direction as the drive direction of the surface plate. Moreover, the polishing pads adjacently arranged in the drive direction of the surface plate are stuck apart in such a manner that the grooves of one polishing pad are spaced not to align with the respective grooves of the other polishing pad.