Abstract: There is provided a cellular phone including (a) a display, (b) a key pad arrangement, (c) a lighting device which lights at least one of the display and the key pad arrangement, (d) a touch sensor which is turned on upon making contact with a user and transmits a first signal, and turned off upon making no contact with a user and transmits a second signal, and (e) a controller which turns the lighting device on upon receiving the second signal from the touch sensor, and turns the lighting device off upon receiving the first signal from the touch sensor. The cellular phone can reduce electric power consumption, because the lighting device does not consume electric power while the cellular phone is in use, enabling a use of a smaller-sized cell.

Abstract: A front lighting unit comprises a protective member fixedly attached to one side of a light conductive member to define therebetween a closed space. This closed space provides seal between the light conductive member and the protective member. A liquid crystal display incorporating the front lighting unit comprises a reflective liquid crystal panel. The light conductive a member is fixedly attached to one side of the liquid crystal panel.

Abstract: A reflection illumination device includes a light guide, light sources, and a reflecting mirror. The light guide is placed in front of an object to be illuminated. The light sources are arranged around the light guide. The reflecting mirror is placed behind the object. One or a plurality of total reflection areas on which projections or recesses each having a triangular cross-section and serving to totally reflect light emitted from the light source toward the object are formed are arranged on the surface of the light guide. Each of the projections or recesses is constituted by an inclined surface inclined at a predetermined angle toward a reference portion positioned at a predetermined position on the light guide, and a vertical surface vertical to the light guide. The light sources and irradiation means for parallelly irradiating the total reflection areas with light from the light sources are arranged at edges of the light guide in correspondence with the total reflection areas.

Abstract: A reflection illumination device includes a light guide, light sources, and a reflecting mirror. The light guide is placed in front of an object to be illuminated. The light sources are arranged around the light guide. The reflecting mirror is placed behind the object. One or a plurality of total reflection areas on which projections or recesses each having a triangular cross-section and serving to totally reflect light emitted from the light source toward the object are formed are arranged on the surface of the light guide. Each of the projections or recesses is constituted by an inclined surface inclined at a predetermined angle toward a reference portion positioned at a predetermined position on the light guide, and a vertical surface vertical to the light guide. The light sources and irradiation means for parallelly irradiating the total reflection areas with light from the light sources are arranged at edges of the light guide in correspondence with the total reflection areas.

Abstract: A front lighting unit comprises a protective member fixedly attached to one side of a light conductive member to define therebetween a closed space. This closed space provides seal between the light conductive member and the protective member. A liquid crystal display incorporating the front lighting unit comprises a reflective liquid crystal panel. The light conductive a member is fixedly attached to one side of the liquid crystal panel.

Abstract: A multichip module (MCM) of the present invention includes a first substrate formed with through holes and having shield electrodes arranged therein. At least one semiconductor device is mounted on one major surface of the first substrate and electrically and mechanically connected to the first substrate by a first conductive material. A second substrate is mounted on the other major surface of the first substrate and formed with through holes. At least one filter device is mounted on the other major surface of the first substrate and electrically and mechanically connected to the first substrate by a second conductive material. The second substrate is electrically connected to the semiconductor device by the through holes and first conductive material. The MCM is capable of enhancing the efficient mounting of devices and promoting easy insulation between the devices.

Abstract: The surface-acoustic-wave device has surface-acoustic-wave element 1 provided with interdigital electrodes 2, shut-off member 32 and ground patterns 35-1, 35-2. Interdigital electrodes 2 are formed on a first surface of surface-acoustic-wave element 1 and covered with protective film 33. Surface-acoustic-wave element 1 is mechanically supported above mounting substrate 36. Shut-off member 32 serves to shut off surface-acoustic-wave element 1 electrically and airtightly from an ambience. The ground patterns 35-1, 35-2, grounded electrically, serve to discharge an electric charge. Ground patterns 35-1, 35-2 contact a surface of mounting substrate 36. Shut-off member 32 covers surface-acoustic-wave element 1 and also is connected with ground patterns 35-1, 35-2 that are in contact with the surface of mounting substrate 36.

Abstract: A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.

Abstract: A surface acoustic wave system having a mounting receptacle on which there are mounted a plurality of surface acoustic wave elements being bonded together by sides of their surface acoustic wave substrates so as to form a single element assembly. With this structure, a plurality of surface acoustic wave elements can be treated as one surface acoustic wave element in the mounting process, and so less problem is taken in the mounting process. For there is no need for saving a space between two neighboring surface acoustic wave elements for the mounting process, the mounting density can be increased. Further, it is possible to bond together the surface acoustic wave elements having different surface acoustic wave substrates and treat the bonded elements as one element, which provides more flexibility to the system design.

Abstract: A resonant circuit of the present invention has a ceramic substrate, a quartz element provided on said substrate, and a capacitor for temperature compensation. Connection terminals are formed on the rear of the substrate in order to mount the resonant circuit to another substrate. A seam ring for air-tight sealing is positioned at the edges of the substrate. The quartz oscillator with this configuration can be mounted without resorting to leads.

Abstract: A surface acoustic wave device of the present invention includes piezo-electric substrates 1 and 2 each having one surface formed with interdigital electrodes 12A, 12B, for transmission and receiving of surface acoustic waves, are received in a casing including a stem 4, a seal ring 9 and a cover plate 5, etc. The piezo-electric substrates 1 and 2 are arranged such that the one surfaces thereof face each other with a predetermined space therebetween and electrically conductive members 3 are disposed between the piezo-electric substrates 1 and 2. The electrically conductive members 3 may be gold bumps, solder bumps, metal balls of such as solder or copper, electrically conductive adhesive members or electrically conductive rubber members, etc. The surface acoustic wave device is applicable to such as filters and featured by having small mounting area and easiness of manufacture.