Abstract: An information processing system includes one or more vehicles, and a server communicable with the one or more vehicles. The vehicle acquires an image obtained by imaging a road on which a host vehicle is located. The vehicle or the server determines a degree of difficulty in traveling on the road due to snow cover from the image. The server stores the degree of difficulty in traveling for each of one or more roads, and provides information to a client by using the stored degree of difficulty in traveling for each of one or more roads.

Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Abstract: Through hole filling pastes which include a magnetic powder (A), an epoxy resin (B), and a curing agent (C), in which the magnetic powder (A) is surface-treated with a surface treating agent containing at least one element selected from Si, Al, and Ti, are capable of achieving a cured product excellent in plating adhesion.

Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Abstract: Through hole filling pastes which include a magnetic powder (A), an epoxy resin (B), and a curing agent (C), in which the magnetic powder (A) is surface-treated with a surface treating agent containing at least one element selected from Si, Al, and Ti, are capable of achieving a cured product excellent in plating adhesion.

Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Abstract: Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.

Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

Abstract: A plastic optical element for an optical system of an optical scanner includes a plurality of optical effective portions through which a plurality of light beams transmit, respectively, formed on at least one of an incidence surface and an exit surface in a sub scan direction, and an optical ineffective portion formed between neighboring optical effective portions not to allow the light beams to transmit therethrough, and including an area in which a local contraction occurs at a time of resin molding.

Abstract: A plastic optical element for an optical system of an optical scanner includes a plurality of optical effective portions through which a plurality of light beams transmit, respectively, formed on at least one of an incidence surface and an exit surface in a sub scan direction, and an optical ineffective portion formed between neighboring optical effective portions not to allow the light beams to transmit therethrough, and including an area in which a local contraction occurs at a time of resin molding.

Abstract: A plastic optical element being configured to collect and scan a beam emitted from at least one light source section, and including a transfer surface which extends in a principal direction corresponding to a scanning direction of the beam and has a curved surface formed to extend into a circular-arc shape in a secondary direction perpendicular to the principal scanning direction, the transfer surface having an optical aids disposed to shift from an outer center of the transfer surface in the secondary scanning direction, and a center of curvature of the curved surface being disposed on the optical axis.

Abstract: Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.

Abstract: A plastic optical element for an optical system of an optical scanner includes a plurality of optical effective portions through which a plurality of light beams transmit, respectively, formed on at least one of an incidence surface and an exit surface in a sub scan direction, and an optical ineffective portion formed between neighboring optical effective portions not to allow the light beams to transmit therethrough, and including an area in which a local contraction occurs at a time of resin molding.

Abstract: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 ?m or below.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: A plastic optical element for focusing light to a target includes a first lens and a second lens. The first lens includes an incident surface, a projection surface opposite the incident surface, and a non-optical surface through which light does not pass and that includes a non-transfer portion. At least one light beam passes from the incident surface to the projection surface. The second lens includes an incident surface, a projection surface opposite the incident surface, and a non-optical surface through which light does not pass and that includes a non-transfer portion disposed opposite the non-optical surface of the first lens. At least one light beam passes from the incident surface to the projection surface. The non-transfer portions of the first lens and the second lens are portions on which no surface is transferred from a surface of a mold used to form the plastic optical element.

Abstract: There is provided an injection mold for molding an optical component including an optical surface, a non-optical surface separated from the optical surface, and a rib provided to an edge portion of the optical surface, and longer in a direction parallel to the optical surface than in a direction perpendicular to the optical surface. The mold includes a transfer piece including a transfer surface that molds the optical surface and a movable cavity piece including a non-transfer surface that molds at least a portion of the non-optical surface. The transfer surface and the non-transfer surface define a cavity to be filled with resin. The movable cavity piece is moved away from the resin during a process of cooling the resin. At least a portion of the non-transfer surface is located closer to the rib than a boundary between the transfer surface and the rib.

Abstract: A molded plastic part prepared by injecting a resin in a cavity of a die so that a pressure is generated in the resin in the cavity and at least one transfer wall surface of the cavity is transferred to the resin. The plastic part has at least one transferred surface; at least one imperfectly transferred concave portion on a first surface thereof other than the transferred surface; and at least one imperfectly transferred convex portion on the first surface or a second surface thereof other than the transferred surface. The ratio (a)/(b) of the thickness (a) of the plastic part in a direction perpendicular to the transferred surface to the thickness (b) of the plastic part in a direction parallel to the transferred surface is less than 1.

Abstract: A plastic article is formable by using a metal die having a cavity to accommodate melted resin therein at a given pressure. The plastic article includes a transfer face to which is transferred a face shape of the metal die, a projection disposed at least one face other than the transfer face, an incomplete transfer face having a concave shape disposed at the same face on which the projection is disposed, formed by an incomplete transfer of a face shape of the cavity of the metal die, and an incomplete transfer face having a convex shape disposed at least one face other than the transfer face.

Abstract: An optical scanning device that scans a plurality of surfaces to be scanned in a main scanning direction by using a light beam includes: a plurality of light sources; a light deflector that deflects a plurality of light beams emitted from the light sources; and a scanning optical system that individually guides each one of the light beams deflected by the light deflector to a corresponding one of the surfaces to be scanned. The scanning optical system includes one scanning lens shared by the light beams, and at least one surface of the scanning lens has a plurality of optical surfaces corresponding to the plurality of light beams disposed in a sub-scanning direction with a flat surface provided between the optical surfaces.