Patents by Inventor Eiichi Igarashi

Eiichi Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sheet-framed IC carrier and method for producing the same
    Patent number: 6581840
    Abstract: A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: June 24, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mitsunori Takeda, Eiichi Igarashi, Hideyo Yoshida
  • Sheet-framed IC carrier and method for producing the same
    Publication number: 20020007554
    Abstract: A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
    Type: Application
    Filed: October 2, 2001
    Publication date: January 24, 2002
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mitsunori Takeda, Eiichi Igarashi, Hideyo Yoshida
  • Sheet-framed IC carrier and method for producing the same
    Patent number: 6320751
    Abstract: A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: November 20, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mitsunori Takeda, Eiichi Igarashi, Hideyo Yoshida
  • SHEET-FRAMED IC CARRIER AND METHOD FOR PRODUCING THE SAME
    Publication number: 20010018984
    Abstract: A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
    Type: Application
    Filed: June 18, 1998
    Publication date: September 6, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: MITSUNORI TAKEDA, EIICHI IGARASHI, HIDEYO YOSHIDA