Abstract: The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.

Abstract: The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40° C., and loses the tack strength at the particular temperature or lower.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: The present invention is to provide a composite film having transparency, strength, elongation, and flexibility. The composite film contains: a urethane polymer formed from a polyol and a polyisocyanate; and an acrylic polymer obtained by photopolymerization of one or more (meth)acrylic monomers, in which total light transmittance of the composite film is 93.0% or more in terms of a thickness of 100 ?m, breaking strength (23° C.) of the composite film is 3.0 MPa or more to 75 MPa or less, breaking elongation ratio (23° C.) is 150% or more to 1,000% or less, and 20% modulus (23° C.) is 0.1 MPa or more to 7.5 MPa or less.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: [Problem] To provide an adhesive sheet for protecting coating films having excellent flexibility. [Means for Solving] The adhesive sheet for protecting coating films comprises an adhesive layer and a base layer provided with a composite film containing at least a urethane polymer, and the adhesive sheet has a 10% modulus at 20° C. of 35 N/cm or less, and a 100% modulus at 20° C. of 8 N/cm or more. A breaking strength of the adhesive sheet for protecting coating films is preferably 40 N/cm or more.

Abstract: Disclosed is a composite film containing an acrylic polymer and a urethane polymer. The acrylic polymer contains an acrylic component including an acrylic acid monomer and a monofunctional (meth)acrylic monomer whose homopolymer has a glass transition temperature (Tg) of not less than 0° C. The acrylic acid monomer content in the acrylic component is not less than 1% by weight but not more than 30% by weight. The urethane polymer contains a urethane component obtained by reacting a diol and a diisocyanate. The diol and diisocyanate are used at an equivalent ratio NCO/OH of 1.1-2.0. The composite film has a content soluble in N,N-dimethylformamide (DMF).

Abstract: The present invention aims to provide a patch and a patch preparation that do not require an acrylic polymer, and are capable of maintaining a large amount of an organic liquid component in an adhesive layer. The present invention provides a patch containing a support and an adhesive layer provided on at least one surface of the support, wherein the adhesive layer contains polyisobutylene, a liquid rubber component having a crosslinkable functional group in a molecule, and an organic liquid component, the adhesive layer is crosslinked.