Patents by Inventor Eiichi Kagawa

Eiichi Kagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093751
    Abstract: Provided is a bumper cap to be attached to a shock absorber main body, and includes a cover part having an opening at one end, having a bottom part and a through hole penetrating the bottom part at another end, and configured to cover the shock absorber main body, and a plurality of protruding parts protruding from the bottom part of the cover part toward the opening side, and in which a gap is formed between the adjacent protruding parts, in which a suppression part configured to suppress a rotation of a fluid, which has flowed into a space between the inside of the cover part and the shock absorber main body from an outside of the cover part through the through hole, in the cover part is further provided.
    Type: Application
    Filed: February 18, 2022
    Publication date: March 21, 2024
    Inventors: Takuya HAKOISHI, Shinichi KAGAWA, Eiichi KOMORI
  • Patent number: 4495569
    Abstract: A multiprocessor system includes a random access memory (85) for storing a processor number data specifying that an interrupt from any of a plurality of devices (6l to 6m) to any one of a plurality of processors (1l to 1n) is permitted. If and when an interrupt request signal is applied from the device (61) to an interrupt controller (8), a processor number data indicating a processor which the device (61) can interrupt is read out from the random access memory (85). The interrupt controller (8) applies an interrupt signal to a processor (11), for example, according to the processor number data. Correspondingly, the processor (11) applies a bus request signal to a bus controller (7). According to the bus request signal, the bus controller (7) controls a bus selecting circuit (3) to connect a local bus (21) of the processor (11) to a common bus (5).
    Type: Grant
    Filed: June 25, 1982
    Date of Patent: January 22, 1985
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Eiichi Kagawa