Abstract: An IR-cut filter comprises a crystal plate and a multilayer film formed on one side of the crystal plate. The multilayer film is composed of first thin films made of a high refractive index material and second thin films made of a low refractive index material, which are alternately layered. The multilayer film is composed of a first layer, a second layer and a third layer sequentially from one side of the crystal plate. Film thicknesses of the layered first and second thin films differ from layer to layer so that the layers have different thicknesses. The layers have thicknesses which are sequentially increased. The multilayer film is provided with a sharpness prevention means for preventing a sharp change in transmittance within a visible region. The sharpness prevention means provides an inflection point at a wavelength band in which transmittance changes sharply.

Abstract: An optical device of the present invention comprises an image sensing device, a package for accommodating the image sensing device, the package including an opening of a square configuration as viewed in plan, and an optical low-pass filter having square-shaped major surfaces and fixed in the opening by means of a UV-curable adhesive. The optical low-pass filter comprises a 45-degree splitting birefringent plate which is machine-cut in such a manner as to split an incident beam in a direction of 45 degrees and to form a two-point split pattern. The optical low-pass filter is formed with a color compensation filter and/or an anti-reflection filter, and further provided with a UV transmission area (e.g. notches, angular grooves) for curing the UV-curable adhesive.

Abstract: An IR-cut filter comprises a crystal plate and a multilayer film formed on one side of the crystal plate. The multilayer film is composed of first thin films made of a high refractive index material and second thin films made of a low refractive index material, which are alternately layered. The multilayer film is composed of a first layer, a second layer and a third layer sequentially from one side of the crystal plate. Film thicknesses of the layered first and second thin films differ from layer to layer so that the layers have different thicknesses. The layers have thicknesses which are sequentially increased. The multilayer film is provided with a sharpness prevention means for preventing a sharp change in transmittance within a visible region. The sharpness prevention means provides an inflection point at a wavelength band in which transmittance changes sharply.

Abstract: An optical device of the present invention comprises an image sensing device, a package for accommodating the image sensing device, the package including an opening of a square configuration as viewed in plan, and an optical low-pass filter having square-shaped major surfaces and fixed in the opening by means of a UV-curable adhesive. The optical low-pass filter comprises a 45-degree splitting birefringent plate which is machine-cut in such a manner as to split an incident beam in a direction of 45 degrees and to form a two-point split pattern. The optical low-pass filter is formed with a color compensation filter and/or an anti-reflection filter, and further provided with a UV transmission area (e.g. notches, angular grooves) for curing the UV-curable adhesive.

Abstract: A chip adhesion preventing device is capable of preventing chips from adhering to the drill shank of a drill held on a spindle (1) included in a boring machine. Fluid passages (17, 23) are formed in the spindle (1) and a work holding member (19), respectively, and nozzle holes (18 and 22) are formed in the spindle (1) and the work holding member (19) so as to be connected to the outlet ends of the fluid passages (17 and 23), respectively, and to be directed toward the shank (13) of the drill (3). A high-pressure fluid is jetted through the nozzle holes (18, 22) toward the drill shank (13) to blow off chips (15) adhering to the drill shank (13).

Abstract: A method for producing a hybrid multi-layered circuit substrate which utilizes prefabricated flexible printed circuit(s) which are rigidized in areas which define high density hybrid circuits. The hybrid circuit regions are formed by disposing copper-lined sheets on both surfaces of the flexible circuit, adhesively bonding the copper-lined sheets to the flexible circuit, forming through-hole conductors and etching a circuit pattern in the copper layer of the lined sheets. The copper-lined sheets are initially general coextensive in size and shape with the flexible circuit and are subsequently severed so that the copper-lined sheets remain only in the hybridized portions of the product. Separation is achieved by mechanically punching along predetermined boundaries and is facilitated by providing either any elongated narrow through-hole at the boundary of the hybrid circuit from which the flexible circuit will extend the end product or by forming a groove in the copper-lined sheets at such boundary.

Abstract: A through-hole pin connection for laminated circuit elements and method of connection are presented. The laminated circuit element consists of a plurality of individual circuit elements, each element having a land area about the periphery of the through-hole. The through-hole pin has at least one ridged region located along the direction of insertion into the through-hole. Upon insertion, the pin guides a solder into the land areas and the ridged region effects electrical and mechanical contact between the through-hole pin and each of the land areas of the laminated circuit element.

Abstract: A switch array is defined by a pair of printed circuits separated by a nonconductive spacer which is provided with apertures which form cavities into which switch contacts on the circuits may be forced to produce switch closures. The spacer is contoured to define gas flow channels which communicate with the cavities whereby switch operation will not be impeded by gas trapped in the cavities.

Abstract: A membrane switch assembly having an apertured air permeable spacer positioned between a pair of printed circuits. Air may diffuse through the permeable material into and out of the regions which define individual switch cavities during operation.