Patents by Inventor Eiichi Kamoshida

Eiichi Kamoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide resin composition
    Patent number: 4804720
    Abstract: Disclosed herein is a polyamide resin composition comprising a polyamide resin, from 0.1 to 1% by weight of fine silica based on the polyamide resin and from 1 to 99% by weight of a silane coupling agent based on the fine silica. The packaging material obtained from the polyamide resin composition of the present invention has uniform and satisfactory transparency and is excellent in the blocking resistance.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: February 14, 1989
    Assignee: Mitsubishi Chemical Industries Limited
    Inventors: Mitsuhiko Tamura, Masaaki Miyamoto, Masaya Ueda, Eiichi Kamoshida
  • Resin composition of a saponified ethylene vinyl acetate copolymer and a polyamide resin
    Patent number: 4795781
    Abstract: A moldable resin composition comprising (1) a saponified ethylene/vinyl acetate copolymer having an ethylene content ranging from 20 to 80 mole % and a saponification degree of not less than 90%, and a polyamide resin containing terminal carboxyl (--COOH) and terminal amide (--CONRR') groups, wherein the number (A) of the terminal carboxyl groups and the number (B) of terminal amide groups satisfies the relationship: ##EQU1## wherein (R) is a hydrocarbyl group of 1 to 22 carbon atoms and R' is a hydrogen atom or a hydrocarbyl group of 1 to 22 carbon atoms.
    Type: Grant
    Filed: July 10, 1986
    Date of Patent: January 3, 1989
    Assignees: Mitsubishi Chemical Industries Limited, Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masaaki Miyamoto, Eiichi Kamoshida, Hiroshi Takida