Patents by Inventor Eiichi Komori

Eiichi Komori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965242
    Abstract: A raw material supply apparatus according to an aspect of the present disclosure includes: a container configured to store a solution of a first solid raw material dissolved in a solvent or a dispersion system of the first solid raw material dispersed in a dispersion medium; a removal part configured to form a second solid raw material by removing the solvent or the dispersion medium from the solution or the dispersion system stored in the container; a detection part configured to detect a completion of a removal of the solvent or the dispersion medium from the solution or the dispersion system; and a heater configured to heat the second solid raw material.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 23, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Seishi Murakami, Tsuneyuki Okabe, Eiichi Komori
  • Publication number: 20240093751
    Abstract: Provided is a bumper cap to be attached to a shock absorber main body, and includes a cover part having an opening at one end, having a bottom part and a through hole penetrating the bottom part at another end, and configured to cover the shock absorber main body, and a plurality of protruding parts protruding from the bottom part of the cover part toward the opening side, and in which a gap is formed between the adjacent protruding parts, in which a suppression part configured to suppress a rotation of a fluid, which has flowed into a space between the inside of the cover part and the shock absorber main body from an outside of the cover part through the through hole, in the cover part is further provided.
    Type: Application
    Filed: February 18, 2022
    Publication date: March 21, 2024
    Inventors: Takuya HAKOISHI, Shinichi KAGAWA, Eiichi KOMORI
  • Publication number: 20230366084
    Abstract: A method includes: obtaining a raw material by heating and sublimating a solid raw material accommodated in a raw material container; supplying, as a raw material gas, the sublimated raw material together with a carrier gas to a consumption region; adjusting a heating temperature of the solid raw material based on a measurement result of an amount of the raw material in the raw material gas; converting a supply amount of the raw material per unit time into a reference temperature supply amount; and estimating a remaining amount of the solid raw material corresponding to the reference temperature supply amount based on a remaining amount-raw material supply amount curve, which indicates a relationship between the remaining amount of the solid raw material in the raw material container and the raw material supply amount when the solid raw material is heated at a reference temperature.
    Type: Application
    Filed: September 16, 2021
    Publication date: November 16, 2023
    Inventors: Yuji OBATA, Eiichi KOMORI, Makoto YOSHIDA
  • Publication number: 20230332285
    Abstract: A powder conveying apparatus, a gas supply apparatus, and a method for removing powder that suppresses internal leakage are provided. A powder conveying apparatus includes a powder transport line via which a powder feedstock source is coupled to a vaporizer, and includes a first valve provided on a powder feedstock source-side of the powder transport line. The powder conveying apparatus includes a second valve provided on a vaporizer-side of the powder transport line, and includes a buffer tank configured to be filled with a purge gas. The powder conveying apparatus includes a first purge-gas supply line coupled to the powder transport line upstream of the second valve, the first purge-gas supply line enabling the purge gas to be supplied from the buffer tank to the second valve. The powder conveying apparatus includes a first purge gas valve provided on the first purge-gas supply line.
    Type: Application
    Filed: September 21, 2021
    Publication date: October 19, 2023
    Inventor: Eiichi KOMORI
  • Publication number: 20230311145
    Abstract: A raw material supply device includes: a container configured to store a solution in which a solid raw material is dissolved in a solvent or a dispersion in which the solid raw material is dispersed in a dispersion medium; an injector configured to spray the solution or the dispersion to inject the solution or the dispersion into the container; and a controller configured to control a spray condition so as to change a spray direction of the solution or the dispersion sprayed from the injector over time.
    Type: Application
    Filed: September 1, 2021
    Publication date: October 5, 2023
    Inventor: Eiichi KOMORI
  • Publication number: 20230311023
    Abstract: A raw material supply device according to an embodiment of the present disclosure generates a reactive gas from a solution obtained by dissolving a solid raw material in a solvent or a dispersion obtained by dispersing the solid raw material in a dispersion medium. The raw material supply device includes: a container configured to store the solution or the dispersion; an injector configured to inject the solution or the dispersion into the container; an exhaust port configured to evacuate an interior of the container; and a filter provided in the container and configured to partition the interior of the container into a plurality of regions including a first region in which the injector is provided and a second region in which the exhaust port is provided.
    Type: Application
    Filed: September 2, 2021
    Publication date: October 5, 2023
    Inventor: Eiichi KOMORI
  • Publication number: 20230238255
    Abstract: A pressure adjusting valve includes a pipe, a valve body arranged inside the pipe, and a support shaft configured to rotatably support the valve body. The pressure adjusting valve is configured to adjust pressure by rotating the valve body. The valve body has, inside the valve body, a valve body side flow path through which a purge gas can flow, and has a plurality of outlets that communicate with the valve body side flow path at an outer periphery of the valve body. The support shaft has a support shaft side flow path for introducing the purge gas into the valve body side flow path.
    Type: Application
    Filed: January 11, 2023
    Publication date: July 27, 2023
    Inventors: Eiichi KOMORI, Tsuneyuki OKABE
  • Publication number: 20230167551
    Abstract: An ozone supply system includes a supply path configured to supply a gas, and an ozone generator, provided in the supply path, and configured to generate ozone using oxygen gas supplied from an upstream end of the supply path, and supply an ozone-containing gas containing the ozone to a downstream end of the ozone generator. The supply path branches into a plurality of branching paths on the downstream end. At least one branching path of the plurality of branching paths is a process branching path connected to a processing part that uses the ozone-containing gas, and a remaining branching path, other than the at least one branching path, of the plurality of branching paths is a waste branching path connected to a waste part configured to discharge the ozone-containing gas. The waste branching path includes a waste flow controller configured to control a flow rate of the ozone-containing gas.
    Type: Application
    Filed: November 16, 2022
    Publication date: June 1, 2023
    Inventor: Eiichi KOMORI
  • Publication number: 20230151486
    Abstract: A raw material supply system includes: a first storage part configured to store a solution obtained by dissolving a first solid raw material in a solvent or a dispersion obtained by dispersing the first solid raw material in the solvent; a second storage part configured to store the solution or the dispersion transported from the first storage part; a detection part configured to detect an amount of the solution or the dispersion stored in the first storage part; and a heating part configured to heat a second solid raw material formed by removing the solvent from the solution or the dispersion stored in the second storage part.
    Type: Application
    Filed: March 4, 2021
    Publication date: May 18, 2023
    Inventor: Eiichi KOMORI
  • Publication number: 20230093077
    Abstract: A substrate processing apparatus includes a processing chamber configured to process a substrate, and a filtration part containing a porous coordination polymer and provided in an exhaust path configured to exhaust a gas from the processing chamber.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 23, 2023
    Inventors: Eiichi KOMORI, Tsuneyuki OKABE
  • Publication number: 20230087577
    Abstract: A substrate processing apparatus includes a processing chamber configured to process a substrate, and a filtration part containing a porous coordination polymer and provided in a supply path configured to supply a gas to the processing chamber.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 23, 2023
    Inventors: Eiichi KOMORI, Tsuneyuki OKABE
  • Publication number: 20220396873
    Abstract: A raw material gas supply system that supplies a raw material gas generated by vaporizing a solid raw material to a processing apparatus includes: a vaporizer configured to vaporize the solid raw material to generate the raw material gas; a delivery mechanism configured to deliver a solution, in which the solid raw material is dissolved in a solvent, from a solution source storing the solution to the vaporizer; and an evaporation mechanism configured to evaporate the solvent of the solution delivered from the delivery mechanism and accommodated in the vaporizer to separate the solid raw material.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 15, 2022
    Inventors: Tsuneyuki OKABE, Shigeyuki OKURA, Eiichi KOMORI
  • Patent number: 11506321
    Abstract: There is provided a pipe heating device, including; a sensor installed in a gas pipe; a heating part having a heat generation portion arranged so as to cover the gas pipe except for a region of the gas pipe where the sensor is installed; and a heat conducting member attached between an outer peripheral surface of the gas pipe and the sensor and formed of a material having a higher thermal conductivity than the gas pipe.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 22, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Tomohisa Kimoto, Eiichi Komori
  • Publication number: 20220341038
    Abstract: A raw material supply apparatus includes: a container configured to store a solution obtained by dissolving a first solid raw material in a solvent or a dispersion system obtained by dispersing the first solid raw material in a dispersion medium; an injection part configured to spray the solution or the dispersion system to inject the solution or the dispersion system into the container; an exhaust port configured to exhaust an inside of the container; a heating part configured to heat a second solid raw material formed by removing the solvent or the dispersion medium from the solution or the dispersion system; and a deposition part provided between the injection part and the exhaust port in the container and configured to deposit the second solid raw material.
    Type: Application
    Filed: September 15, 2020
    Publication date: October 27, 2022
    Inventors: Tsuneyuki OKABE, Eiichi KOMORI
  • Publication number: 20220341037
    Abstract: A raw material supply apparatus according to an aspect of the present disclosure includes: a container configured to store a solution of a first solid raw material dissolved in a solvent or a dispersion system of the first solid raw material dispersed in a dispersion medium; a removal part configured to form a second solid raw material by removing the solvent or the dispersion medium from the solution or the dispersion system stored in the container; a detection part configured to detect a completion of a removal of the solvent or the dispersion medium from the solution or the dispersion system; and a heater configured to heat the second solid raw material.
    Type: Application
    Filed: September 15, 2020
    Publication date: October 27, 2022
    Inventors: Seishi MURAKAMI, Tsuneyuki OKABE, Eiichi KOMORI
  • Publication number: 20220333237
    Abstract: A raw material gas supply system for supplying a raw material gas generated by vaporizing a solid raw material to a processing apparatus, includes a vaporization device configured to vaporize the solid raw material to generate the raw material gas, a delivery mechanism configured to deliver a dispersion containing the solid raw material dispersed in a liquid from a storage container storing the dispersion to the vaporization device, and a separation mechanism configured to separate the solid raw material from the dispersion in the vaporization device.
    Type: Application
    Filed: September 9, 2020
    Publication date: October 20, 2022
    Inventors: Tsuneyuki OKABE, Shigeyuki OKURA, Eiichi KOMORI
  • Publication number: 20220243321
    Abstract: A powder transfer apparatus includes: a powder transfer pipe connecting a powder raw material supply source to a vaporizer and configured to supply a powder to the vaporizer from the powder raw material supply source; a first purge gas supply pipe connecting a buffer tank to the powder transfer pipe at a first branch point and configured to supply a purge gas from the buffer tank to the powder transfer pipe; a first valve that is closer to the powder raw material supply source than the first branch point is; a second valve that is closer to the vaporizer than the first branch point is, an opening degree of the second valve being adjustable; a first purge gas valve provided on the first purge gas supply pipe; and a controller configured to control opening and closing of the first valve, the second valve, and the first purge gas valve.
    Type: Application
    Filed: January 19, 2022
    Publication date: August 4, 2022
    Inventor: Eiichi KOMORI
  • Patent number: 11306847
    Abstract: A valve device includes: valves configured to control a flow of processing gases supplied to a process vessel; a housing in which first flow paths through which the processing gases flow are formed; a heat diffuser configured to cover the housing and diffuse heat of the housing; a heating part configured to cover the housing covered with the heat diffuser and heat the housing via the heat diffuser; a supply configured to supply a coolant to a second flow path formed between the housing and the heat diffuser; and a controller configure to control the heating part to heat the housing to a first temperature when a predetermined process is performed on a target substrate, and before a start of a cleaning process of the process vessel, control the heating part to stop heating of the housing and control the supply to supply the coolant to the second flow path.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: April 19, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Tomohisa Kimoto, Yuichi Furuya, Takashi Kakegawa, Eiichi Komori, Hideaki Fujita, Hiroyuki Mori
  • Patent number: 11286563
    Abstract: In a substrate processing apparatus for performing substrate processing by supplying, to a substrate, a source gas containing a source material of a film to be formed on the substrate, a processing chamber in which the substrate is mounted is provided. A source gas supply unit is configured to contain the source material and supplies the source gas toward the processing chamber. A buffer tank is configured to temporarily store the source gas received from the source gas supply unit. A valve arrangement unit in which supply on/off valves, each of which is configured to perform a supply and a shut-off of the supply of the source gas stored in the buffer tank to the processing chamber, are arranged. The valve arrangement unit, the buffer tank, and the source gas supply unit are arranged, in this order, above the processing chamber from the bottom side of the substrate processing apparatus.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: March 29, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Eiichi Komori
  • Patent number: 11236425
    Abstract: A method of processing each of a plurality of substrates comprises: obtaining a first correction factor based on a first flow rate set value of a mass flow controller and a first measurement value of a mass flow meter; adjusting the first flow rate set value of the mass flow controller with the first correction factor so that the flow rate of the vaporized raw material becomes equal to a target value to process the substrate; obtaining a second correction factor based on a second flow rate set value of the mass flow controller and a second measurement value of the mass flow meter; and adjusting the second flow rate set value of the mass flow controller with the second correction factor so that the flow rate of the vaporized raw material becomes equal to the target value to process the substrate.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: February 1, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kennan Mo, Nuri Choi, Kouichi Sekido, Katsumasa Yamaguchi, Eiichi Komori