Patents by Inventor Eiichi Matsuzawa

Eiichi Matsuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10823778
    Abstract: An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: November 3, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shuji Akiyama, Takeo Saito, Eiichi Matsuzawa
  • Publication number: 20190041454
    Abstract: An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.
    Type: Application
    Filed: July 30, 2018
    Publication date: February 7, 2019
    Inventors: Shuji AKIYAMA, Takeo SAITO, Eiichi MATSUZAWA
  • Patent number: 7701236
    Abstract: A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: April 20, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Shuji Akiyama, Tadashi Obikane, Masaru Suzuki, Yasuhito Yamamoto, Kazuya Yano, Yuji Asakawa, Kazumi Yamagata, Shigeki Nakamura, Eiichi Matsuzawa, Kazuhiro Ozawa, Fumito Kagami, Shinji Kojima
  • Publication number: 20080290886
    Abstract: A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.
    Type: Application
    Filed: May 14, 2008
    Publication date: November 27, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shuji Akiyama, Tadashi Obikane, Masaru Suzuki, Yasuhito Yamamoto, Kazuya Yano, Yuji Asakawa, Kazumi Yamagata, Shigeki Nakamura, Eiichi Matsuzawa, Kazuhiro Ozawa, Fumito Kagami, Shinji Kojima