Patents by Inventor Eiichi Mikogai

Eiichi Mikogai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing connector and connector produced by the same process
    Patent number: 8092263
    Abstract: An object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external force to a surface of the tin-containing material layer, and a connector produced by the same process. In a production process of a connector comprising a step of providing a substrate layer on a surface of the material to surface treat the material and a step of providing a tin-containing material layer on an upside of the substrate layer to surface treat the substrate layer, the object can be achieved by further comprising a step of providing a barrier intermediate layer before the provision of the tin-containing material layer.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: January 10, 2012
    Assignee: DDK Ltd.
    Inventors: Hiroyuki Moriuchi, Yoshihiro Tadokoro, Eiichi Mikogai, Yoshiichi Nakano
  • PROCESS FOR PRODUCING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PRODUCED BY THE SAME PROCESS
    Publication number: 20100255735
    Abstract: An object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external force to a surface of the tin-containing material layer, and a connector produced by the same process. In a production process of a connector comprising a step of providing a substrate layer on a surface of the material to surface treat the material and a step of providing a tin-containing material layer on an upside of the substrate layer to surface treat the substrate layer, the object can be achieved by further comprising a step of providing a barrier intermediate layer before the provision of the tin-containing material layer.
    Type: Application
    Filed: July 7, 2008
    Publication date: October 7, 2010
    Inventors: Hiroyuki Moriuchi, Yoshihiro Tadokoro, Eiichi Mikogai, Yoshiichi Nakano