Abstract: A process for preparing a polyamide type film which comprises melt-extruding a polyamide resin having a metal compound and a melt specific resistance of not more than 1.5.times.10.sup.5 .OMEGA.cm at 260.degree. C. in a form of a film, contacting the melt-extruded film closely with a revolving cooling drum through static electricity and taking up the film while cooling rapidly to solidify, which provides remarkable improved adhesion by static electricity. As a result, increasing the take-up rate of the revolving cooling drum does not cause trapping of air between the drum and the film so that a film having excellent uniformity in thickness and transparency can be produced.