Patents by Inventor Eiichi Nakazawa

Eiichi Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12227391
    Abstract: A vibration damping device for reducing vibration of an elevator rope includes a displacement amplifier arranged around a region from a first portion of the elevator rope drawn and a second portion of the elevator rope drawn from an opposite side of one or more sheaves in parallel with the first portion. The displacement amplifier is configured to amplify a displacement of each of the first portion and the second portion of the elevator rope. The device also includes a limiting member that controls displacement amplification performed by the displacement amplifier such that the displacement of the first portion or the second portion amplified by the displacement amplifier does not become greater than a first displacement, which is a displacement of the elevator rope by which the elevator rope is not allowed to return to an equilibrium position of the vibration.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: February 18, 2025
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Eiichi Saito, Takahide Hirai, Seiji Watanabe, Daisuke Nakazawa, Daiki Fukui, Tomohiro Asamura, Yusuke Chikada
  • Patent number: 5929511
    Abstract: A lead frame is made from a body including a Cu layer and stacked plate layers including an Ni layer, a Pd layer and an Au layer formed on the body. The lead frame includes a die pad, die-pad supports, inner leads, dam-bars, outer leads and an outer frame. No Au layer is formed in a gate runner portion. Since the Pd layer with poor adhesion to a sealing resin is exposed in the gate runner portion, the sealing resin remaining in the gate runner portion can be easily removed by punching pilot holes from the rear side after completing a resin sealing procedure. Thus, the lead frame can be definitely prevented from being deformed without providing any additional element.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: July 27, 1999
    Assignee: Matsushita Electronics Corporation
    Inventors: Eiichi Nakazawa, Takashi Ikeda, Tomohiko Iwasaki, Tadahiko Aiba, Shigeo Yoshida