Abstract: A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device.

Abstract: A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device.

Abstract: A heat dissipation structure of a semiconductor device with excellent heat dissipation applicable to surface-mount thin semiconductor devices is provided, and preferably a heat dissipation structure of a semiconductor device also with excellent insulating reliability is provided. In a heat dissipation structure 101 of a semiconductor device 10, the semiconductor device 10 has an electric bonding surface 11a electrically connected with a substrate 20 and a heat dissipation surface 11b on an opposite side thereof, wherein the heat dissipation surface 11b is bonded or contacted to a heat spreader 31 via a non-insulated member 32, and the heat spreader 31 is bonded or contacted to a heat sink 30 via an insulated member 41.

Abstract: A heat dissipation structure of a semiconductor device with excellent heat dissipation applicable to surface-mount thin semiconductor devices is provided, and preferably a heat dissipation structure of a semiconductor device also with excellent insulating reliability is provided. In a heat dissipation structure 101 of a semiconductor device 10, the semiconductor device 10 has an electric bonding surface 11a electrically connected with a substrate 20 and a heat dissipation surface 11b on an opposite side thereof, wherein the heat dissipation surface 11b is bonded or contacted to a heat spreader 31 via a non-insulated member 32, and the heat spreader 31 is bonded or contacted to a heat sink 30 via an insulated member 41.

Abstract: An optical coupler has a first terminal board and a second terminal board, a first conversion element for converting an electrical signal into an optical signal mounted on a surface of a first element mounting section of the first terminal board, a second conversion element for converting an optical signal into an electrical signal mounted on a surface of a second element mounting section of the second terminal board; and a light reflective curved surface formed so as to cover the first conversion element and the second conversion element. The surfaces of the first element mounting section and the second element mounting section have the same orientation. An optical signal emitted from the first conversion element is reflected on the light reflective curved surface, to optically couple the first conversion element and the second conversion element.

Abstract: An acoustic sensing element has a substrate that includes a back chamber, a vibration electrode plate that is provided in a surface of the substrate while being opposite an upper surface opening of the back chamber, and a fixed electrode plate that is provided opposite the vibration electrode plate, an acoustic hole being made in the fixed electrode plate. The acoustic sensing element outputs an electric signal based on an electrostatic capacitance change generated between the vibration electrode plate and the fixed electrode plate by a displacement of the vibration electrode plate. A lower surface of the back chamber is closed into a pouched shape by the substrate.

Abstract: An acoustic sensing element has a substrate that includes a back chamber, a vibration electrode plate that is provided in a surface of the substrate while being opposite an upper surface opening of the back chamber, and a fixed electrode plate that is provided opposite the vibration electrode plate, an acoustic hole being made in the fixed electrode plate. The acoustic sensing element outputs an electric signal based on an electrostatic capacitance change generated between the vibration electrode plate and the fixed electrode plate by a displacement of the vibration electrode plate. A lower surface of the back chamber is closed into a pouched shape by the substrate.

Abstract: An optical coupler has a first terminal board and a second terminal board, a first conversion element for converting an electrical signal into an optical signal mounted on a surface of a first element mounting section of the first terminal board, a second conversion element for converting an optical signal into an electrical signal mounted on a surface of a second element mounting section of the second terminal board; and a light reflective curved surface formed so as to cover the first conversion element and the second conversion element. The surfaces of the first element mounting section and the second element mounting section have the same orientation. An optical signal emitted from the first conversion element is reflected on the light reflective curved surface, to optically couple the first conversion element and the second conversion element.

Abstract: Optical fiber guides are provided outside a waveguide mounting region of a supporting substrate. Optical fibers are provided so as to be fitted in the optical fibers, respectively. In addition, end faces of the optical fibers and end faces to which a core of an optical waveguide is exposed are opposed and almost parallel to each other. Furthermore, the end face to which the core of the optical waveguide is exposed is provided so as to form an acute angle with a surface of the supporting substrate. Thus, tip ends of the optical fibers are not likely to be shifted from the core in a thickness direction of an optical waveguide device.

Abstract: Optical fiber guides are provided outside a waveguide mounting region of a supporting substrate. Optical fibers are provided so as to be fitted in the optical fibers, respectively. In addition, end faces of the optical fibers and end faces to which a core of an optical waveguide is exposed are opposed and almost parallel to each other. Furthermore, the end face to which the core of the optical waveguide is exposed is provided so as to form an acute angle with a surface of the supporting substrate. Thus, tip ends of the optical fibers are not likely to be shifted from the core in a thickness direction of an optical waveguide device.