Patents by Inventor Eiichi Shinozaki

Eiichi Shinozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5025348
    Abstract: A bonding structure and a bonding method for connecting an IC unit having an insulating sheet to connecting terminals arranged on a substrate. The insulating sheet has an elongated opening which is formed along one side of said insulating sheet and has on its one surface a plurality of conductive metal leads adhered thereto which stretch over the elongated opening. Portions of the metal leads which stretch over the elongated opening are solder-plated to serve as connecting portions. The connecting portions of the metal leads are heated and pressed into the opening with use of a heat-pressing head which has a width narrower than the opening, thereby being soldered to the connecting terminals. The metal lead is formed with inclined parts at its positions corresponding to both sides of the portion depressed by the heat-pressing head and solder pools are formed between the inclined parts and the connecting terminals.
    Type: Grant
    Filed: November 14, 1988
    Date of Patent: June 18, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Satoshi Suzuki, Osamu Kuwabara, Jiro Muto, Eiichi Shinozaki
  • Patent number: 4263006
    Abstract: A method for manufacturing a diamond tool having a shank, comprising accurately arranging a diamond chip on an upper surface of a base body in such a manner that the cutting edge of the chip projects from the end of the body by a predetermined distance, provisionally securing the chip to the upper surface of the body by means of an adhesive, fitting the body and an insert having an exposed clayish fixture in a U-shaped channel of a lower die to penetrate and position the cutting edge portion of the chip into the fixture of the insert, passing an upper die against the lower die after the fixture is cured, charging a predetermined amount of powder metals into a vertical hole formed in the upper die, pressurizing the powder metals by a press rod which is inserted in the vertical hole while heating the upper and lower dies in order to sinter the powder metals on the upper surface of the body and in the U-shaped channel of the lower die, thereby to rigidly fix the chip to the body, and shaping the body so as to pr
    Type: Grant
    Filed: January 21, 1980
    Date of Patent: April 21, 1981
    Assignee: Fuji Dia Co., Ltd.
    Inventor: Eiichi Shinozaki
  • Patent number: 4205425
    Abstract: A method for manufacturing a diamond tool having a shank, comprising accurately arranging a diamond chip on an upper surface of a base body in such a manner that the cutting edge of the chip projects from the end of the body by a predetermined distance, provisionally securing the chip to the upper surface of the body by means of an adhesive, fitting the body and an insert having an exposed clayish fixture in a U-shaped channel of a lower die to penetrate and position the cutting edge portion of the chip into the fixture of the insert, passing an upper die against the lower die after the fixture is cured, charging a predetermined amount of powder metals into a vertical hole formed in the upper die, pressurizing the powder metals by a press rod which is inserted in the vertical hole while heating the upper and lower dies in order to sinter the powder metals on the upper surface of the body and in the U-shaped channel of the lower die, thereby to rigidly fix the chip to the body, and shaping the body so as to pr
    Type: Grant
    Filed: March 17, 1978
    Date of Patent: June 3, 1980
    Assignee: Fuji Die Co., Ltd.
    Inventor: Eiichi Shinozaki