Abstract: An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s, (c) an organohydrogen polysiloxane represented by R4aHbSiO(4-a-b)/2, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si—O—Ce bond, and an Si—O—Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

Abstract: An organic modified silicone resin composition includes: (A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of (a) a compound shown by the general formula (1) having SiH groups and (b) a polycyclic hydrocarbon having addition reactive carbon-carbon double bonds; (B) a siloxane having an SiH group and an organic group substituted with an alkoxysilyl group and/or a siloxane having an SiH group and an organic group substituted with an epoxy group; (C) a compound having three or more SiH groups in one molecule; (D) a catalyst; and (E) fumed inorganic oxide. The formulation amount of the component (E) is 1 to 10 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C); and having a viscosity of 10 to 100 Pa·s at 25° C.

Abstract: An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s, (c) an organohydrogen polysiloxane represented by R4aHbSiO(4-a-b)/2), (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si—O—Ce bond, and an Si—O—Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

Abstract: An organic modified silicone resin composition includes: (A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of (a) a compound shown by the general formula (1) having SiH groups and (b) a polycyclic hydrocarbon having addition reactive carbon-carbon double bonds; (B) a siloxane having an SiH group and an organic group substituted with an alkoxysilyl group and/or a siloxane having an SiH group and an organic group substituted with an epoxy group; (C) a compound having three or more SiH groups in one molecule; (D) a catalyst; and (E) fumed inorganic oxide. The formulation amount of the component (E) is 1 to 10 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C); and having a viscosity of 10 to 100 Pa·s at 25° C.

Abstract: A silicone adhesive used for bonding semiconductor device, containing (A) addition reaction-curable silicone resin composition having viscosity at 25° C. of 100 Pa·s or less, (B) thermal conductive filler having average particle size of 0.1 ?m or more and less than 1 ?m, and (C) solvent having boiling point of 250° C. or higher and lower than 350° C., wherein component (B) is contained in an amount of 100 to 500 parts by mass based on 100 parts by mass of component (A), component (C) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of component (A), and silicone adhesive uncured has viscosity at 25° C. of 5 to 100 Pa·s. Thus, silicone adhesive has good workability in transferring method to substrate, and is capable of providing cured product that can effectively dissipate heat generated from chip and exhibits high adhesiveness and durability.

Abstract: A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 ?m or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.

Abstract: A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 ?m or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.

Abstract: Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.

Abstract: Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst.

Abstract: Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Abstract: Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst.

Abstract: Provided is a polycyclic hydrocarbon group-containing organosilicon compound, which includes two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule. The polycyclic hydrocarbon group-containing organosilicon compound is produced by conducting an addition reaction between the above component (a) and the above component (b) in the presence of a hydrosilylation reaction catalyst.

Abstract: The present invention provides a curable composition that has a high degree of hardness, excellent heat resistance and crack resistance, and is useful as a sealing material for optical elements and the like. The curable composition according to the present invention is a polycyclic hydrocarbon group-containing silicone-based curable composition comprising: (A) an addition reaction product of (a) a specific organosilicon compound containing two hydrosilyl groups, and (b) a polycyclic hydrocarbon containing two addition reactive carbon-carbon double bonds within each molecule, wherein the addition reaction product contains at least two addition reactive carbon-carbon double bonds within each molecule, (B) a compound containing three or more hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, and (D) a stabilizer containing a hindered amine structure and a phenol structure within each molecule.

Abstract: Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.

Abstract: A curable silicone resin composition is provided. It includes (A) an aromatic ring-containing hydrocarbon compound containing at least 2 silicon-bonded hydrogen atoms, in which the silicon atoms are bonded to the hydrocarbon skeleton; (B) an organopolysiloxane with a branched or three dimensional network structure, and with a viscosity at 25° C. of at least 1,000 mPa·s, having an average composition formula (1): R1xSiO{(4?x)/2}??(1) wherein, R1 independently represent a substituted or unsubstituted monovalent hydrocarbon group, a substituted or unsubstituted hydrocarbyloxy group, or a hydroxyl group, provided from 0.1 to 80 mol % of all the R1 groups are alkenyl groups, and x represents a positive number that satisfies 1?x<2; and (C) a hydrosilylation reaction catalyst. The composition yields a cured product that is transparent and displays excellent hardness and flexural strength.

Abstract: Provided is a curable silicone resin composition including (A) a siloxane/polycyclic hydrocarbon-based compound containing at least 2 silicon-bonded hydrogen atoms, which is an addition reaction product of (a) a siloxane-based compound with at least 3 silicon-bonded hydrogen atoms, and (b) a polycyclic hydrocarbon with at least 2 addition reactive carbon-carbon double bonds, (B) a siloxane-based compound containing at least 2 silicon-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.

Abstract: Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Abstract: Provided is a curable composition including (A) an addition reaction product of (a) a compound with 2 silicon atom-bonded hydrogen atoms within each molecule, having a general formula (1): wherein, A is a bivalent group represented by a formula (2): (wherein, R? represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 6 carbon atoms, and n represents an integer from 0 to 100), or a group having a structural formula (3): and each R represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 6 carbon atoms, and (b) a polycyclic hydrocarbon with 2 addition reactive carbon-carbon double bonds within each molecule, said addition reaction product containing at least two addition reactive carbon-carbon double bonds in each molecule, (B) a compound with at least 3 silicon atom-bonded hydrogen atoms within each molecule, and (C) a hydrosilylation reaction catalyst.

Abstract: Epoxy-modified low molecular weight silicones are added to epoxy resins for reducing surface tension and improving fluidity.

Abstract: Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.