Patents by Inventor Eiichiro Dobashi
Eiichiro Dobashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11960139Abstract: The present technology relates to a camera module that is enabled to have a lower height. The camera module includes a supporting component that includes an opening through which light from a lens collecting the light passes, the supporting component supporting an optical component between the lens and an imaging element that performs photoelectric conversion of the light, the optical component being placed so as to cover the opening and being supported on a side of the supporting component closer to the imaging element. In addition, around the opening, there is disposed a sloped portion inclined in the thickness direction of the supporting component, and the supporting component is placed such that the slope of the sloped portion and the lens face each other.Type: GrantFiled: February 13, 2019Date of Patent: April 16, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: Eiichiro Dobashi
-
Publication number: 20230117904Abstract: The present disclosure relates to a sensor package, a method of manufacturing the same, and an imaging device that can achieve downsizing and height reduction and suppress occurrence of a flare. A sensor package includes: a solid-state imaging element that generates a pixel signal by photoelectric conversion in accordance with a light amount of incident light; a circuit board electrically connected to the solid-state imaging element; a sensor package substrate that is arranged on an incident light side of the solid-state imaging element and brings the solid-state imaging element into a sealed state; and a lens formed on a lower surface of the sensor package substrate, the lower surface being located on a side of the solid-state imaging element. The present disclosure can be applied to, for example, the imaging device or the like.Type: ApplicationFiled: March 3, 2021Publication date: April 20, 2023Inventor: EIICHIRO DOBASHI
-
Patent number: 11609362Abstract: The present disclosure relates to a stacked lens structure and a method of manufacturing the same, and an electronic apparatus by which it is possible to realize miniaturization of a lens module. A stacked lens structure includes plural substrates with lens stacked on one another, the substrate with lens each having a lens disposed on inside of a through-hole formed in the substrate. In regard of side surfaces at side parts corresponding to sides of a rectangle surrounding the substrate with lens in plan view as viewed in an optical axis direction, a width and a shape are the same among all the substrates with lens, whereas in regard of side surfaces at opposite angle parts corresponding to opposite angles of the rectangle, the width or shape differs between at least two substrates with lens. The present technology is applicable, for example, to a lens module or the like.Type: GrantFiled: March 19, 2019Date of Patent: March 21, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Eiichiro Dobashi, Shunsuke Maruyama
-
Publication number: 20220260754Abstract: Manufacturing an imaging apparatus including, in an imaging lens optical system, a function to correct aberration is facilitated. A meta-lens and an imaging element constituting the imaging apparatus are formed by a semiconductor process. The meta-lens corrects aberration in the imaging lens optical system. The imaging element images incident light incident via the imaging lens optical system. The meta-lens may be formed inside the imaging element or on a surface of the imaging element or may be formed as a part of a wafer level chip size package.Type: ApplicationFiled: April 28, 2020Publication date: August 18, 2022Inventor: EIICHIRO DOBASHI
-
Publication number: 20210096318Abstract: The present technology relates to a camera module that is enabled to have a lower height. The camera module includes a supporting component that includes an opening through which light from a lens collecting the light passes, the supporting component supporting an optical component between the lens and an imaging element that performs photoelectric conversion of the light, the optical component being placed so as to cover the opening and being supported on a side of the supporting component closer to the imaging element. In addition, around the opening, there is disposed a sloped portion inclined in the thickness direction of the supporting component, and the supporting component is placed such that the slope of the sloped portion and the lens face each other.Type: ApplicationFiled: February 13, 2019Publication date: April 1, 2021Inventor: EIICHIRO DOBASHI
-
Publication number: 20210055458Abstract: The present disclosure relates to a stacked lens structure and a method of manufacturing the same, and an electronic apparatus by which it is possible to realize miniaturization of a lens module. A stacked lens structure includes plural substrates with lens stacked on one another, the substrate with lens each having a lens disposed on inside of a through-hole formed in the substrate. In regard of side surfaces at side parts corresponding to sides of a rectangle surrounding the substrate with lens in plan view as viewed in an optical axis direction, a width and a shape are the same among all the substrates with lens, whereas in regard of side surfaces at opposite angle parts corresponding to opposite angles of the rectangle, the width or shape differs between at least two substrates with lens. The present technology is applicable, for example, to a lens module or the like.Type: ApplicationFiled: March 19, 2019Publication date: February 25, 2021Inventors: EIICHIRO DOBASHI, SHUNSUKE MARUYAMA
-
Patent number: 10462339Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: GrantFiled: May 16, 2019Date of Patent: October 29, 2019Assignee: Sony CorporationInventor: Eiichiro Dobashi
-
Publication number: 20190273851Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: ApplicationFiled: May 16, 2019Publication date: September 5, 2019Applicant: Sony CorporationInventor: Eiichiro Dobashi
-
Patent number: 10356295Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.Type: GrantFiled: August 27, 2018Date of Patent: July 16, 2019Assignee: Sony CorporationInventors: Eiichiro Dobashi, Shuichi Mochinaga
-
Patent number: 10341542Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: GrantFiled: February 16, 2017Date of Patent: July 2, 2019Assignee: Sony CorporationInventor: Eiichiro Dobashi
-
Patent number: 10270946Abstract: There is provided a solid state imaging device. A rib is arranged on a frame part to be joined to a board on which an image sensor is mounted, the rib abutting on the board at an abutting position next to a periphery of the image sensor.Type: GrantFiled: March 12, 2014Date of Patent: April 23, 2019Assignee: Sony CorporationInventor: Eiichiro Dobashi
-
Patent number: 10181446Abstract: The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole.Type: GrantFiled: November 13, 2015Date of Patent: January 15, 2019Assignee: SONY CORPORATIONInventors: Eiichiro Dobashi, Takahiro Wakabayashi
-
Publication number: 20180367716Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.Type: ApplicationFiled: August 27, 2018Publication date: December 20, 2018Applicant: SONY CORPORATIONInventors: Eiichiro DOBASHI, Shuichi MOCHINAGA
-
Patent number: 10091403Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.Type: GrantFiled: July 1, 2015Date of Patent: October 2, 2018Assignee: Sony CorporationInventors: Eiichiro Dobashi, Shuichi Mochinaga
-
Patent number: 10021283Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: GrantFiled: December 20, 2016Date of Patent: July 10, 2018Assignee: Sony CorporationInventor: Eiichiro Dobashi
-
Publication number: 20170330847Abstract: The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole.Type: ApplicationFiled: November 13, 2015Publication date: November 16, 2017Inventors: EIICHIRO DOBASHI, TAKAHIRO WAKABAYASHI
-
Publication number: 20170180613Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.Type: ApplicationFiled: July 1, 2015Publication date: June 22, 2017Applicant: SONY CORPORATIONInventors: Eiichiro DOBASHI, Shuichi MOCHINAGA
-
Publication number: 20170163859Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: ApplicationFiled: February 16, 2017Publication date: June 8, 2017Inventor: Eiichiro Dobashi
-
Publication number: 20170104904Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: ApplicationFiled: December 20, 2016Publication date: April 13, 2017Inventor: Eiichiro Dobashi
-
Patent number: 9554025Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.Type: GrantFiled: November 12, 2014Date of Patent: January 24, 2017Assignee: Sony CorporationInventor: Eiichiro Dobashi