Abstract: Provided is an oxide semiconductor thin film for which only carrier concentration has been reduced while maintaining a high carrier mobility, as well as a manufacturing method therefor. Provided is an amorphous oxide semiconductor thin film that includes indium and gallium as oxides, further includes hydrogen, has a gallium content such that the molecular ratio Ga/(In+Ga) is 0.15 to 0.55, and has a hydrogen content as measured by secondary ion mass spectrometry of 1.0×1020 atoms/cm3 to 1.0×1022 atoms/cm3.

Abstract: Provided is a sputtering target with which it is possible to manufacture an amorphous or crystalline oxide semiconductor thin film with an annealing treatment at a lower temperature than previously, said oxide semiconductor thin film comprising indium and gallium and having a high carrier mobility. Also provided is an oxide sintered body comprising indium and gallium, said oxide sintered body being optimal for obtaining said sputtering target. An oxide sintered body comprising oxides of indium and gallium, wherein the oxide sintered body is characterized by having a gallium content according to the atomic ratio Ga/(In+Ga) of 0.10 to 0.49, having a CIE 1976 color space L* value of 50 to 68, and being composed of an In2O3 phase with a bixbyite-type structure and, as a formation phase other than the In2O3 phase, a GaInO3 phase with a ?-Ga2O3-type structure, or a GaInO3 phase with a ?-Ga2O3-type structure and a (Ga, In)2O3 phase.

Abstract: Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an oxide semiconductor thin film by a sputtering method, and a sputtering target which uses the oxide sintered compact. This oxide sintered compact contains oxides of indium, gallium, and aluminum. The gallium content is from 0.15 to 0.49 by Ga/(In+Ga) atomic ratio, and the aluminum content is from 0.0001 to less than 0.25 by Al/(In+Ga+Al) atomic ratio. A crystalline oxide semiconductor thin film formed using this oxide sintered compact as a sputtering target is obtained at a carrier density of 4.0×1018 cm?3 or less and a carrier mobility of 10 cm?2V?1sec?1 or greater.

Abstract: Provided is an oxide sintered body that, when used to obtain an oxide semiconductor thin film by sputtering, can achieve a low carrier concentration and a high carrier mobility. Also provided is a sputtering target using the oxide sintered body. The oxide sintered body contains, as oxides, indium, gallium, and at least one positive divalent element selected from the group consisting of nickel, cobalt, calcium, strontium, and lead. The gallium content, in terms of the atomic ratio Ga/(In+Ga), is from 0.20 to 0.45, and the positive divalent element content, in terms of the atomic ratio M/(In+Ga+M), is from 0.0001 to 0.05. The amorphous oxide semiconductor thin film, which is formed using the oxide sintered body as a sputtering target, can achieve a carrier concentration of less than 3.0×1018 cm?3 and a carrier mobility of at least 10 cm2V?1 sec?1.

Abstract: Provided are: a sintered oxide which achieves low carrier density and high carrier mobility when configured as an oxide semiconductor thin-film by using the sputtering method; and a sputtering target using the same. This sintered oxide contains indium, gallium and magnesium as oxides. It is preferable for the gallium content to be 0.20-0.45, inclusive, in terms of an atomic ratio (Ga/(In+Ga)), the magnesium content to be at least 0.0001 and less than 0.05 in terms of an atomic ratio (Mg/(In+Ga+Mg)), and the sintering to occur at 1,200-1,550° C., inclusive. An amorphous oxide semiconductor thin-film obtained by forming this sintered oxide as a sputtering target is capable of achieving a carrier density of less than 3.0×1018 cm?3, and a carrier mobility of 10 cm2V?1 sec?1 or higher.

Abstract: Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an oxide semiconductor thin film by a sputtering method, and a sputtering target which uses the oxide sintered compact. This oxide sintered compact contains oxides of indium, gallium, and aluminum. The gallium content is from 0.15 to 0.49 by Ga/(In+Ga) atomic ratio, and the aluminum content is from 0.0001 to less than 0.25 by Al/(In+Ga+Al) atomic ratio. A crystalline oxide semiconductor thin film formed using this oxide sintered compact as a sputtering target is obtained at a carrier density of 4.0×1018 cm?3 or less and a carrier mobility of 10 cm?2V?1sec?1 or greater.

Abstract: Provided is a crystalline oxide semiconductor thin film comprising only bixbyite-structured In2O3 phase, suitable as a channel layer material for a thin film transistor, and having excellent etching properties in an amorphous state and a low carrier density and high carrier mobility in a crystalline state. An amorphous oxide thin film is formed using, as a target, an oxide sintered body which comprises indium, gallium, oxygen, and unavoidable impurities, the gallium content being in a range of 0.09 to 0.45 in terms of a Ga/(In+Ga) atomic ratio, has a In2O3 phase having a bixbyite structure as the main crystal phase, and has a GaInO3 phase having a ?-Ga2O3-type structure, or a GaInO3 phase having a ?-Ga2O3-type structure and a (Ga, In)2O3 phase finely dispersed therein. The amorphous oxide thin film is finely processed by performing etching using photolithography, and is annealed.

Abstract: Provided are: a sintered oxide which is capable of obtaining low carrier density and high carrier mobility when configured as an oxide semiconductor thin film by using a sputtering method; and a sputtering target which uses the same. The sintered oxide contains indium, gallium and copper as oxides. It is preferable for the gallium content to be at least 0.08 and less than 0.20 when expressed as an atomic ratio (Ga/(In+Ga)), the copper content to be at least 0.001 and less than 0.03 when expressed as an atomic ratio (Cu/(In+Ga+Cu)), and for the sintering to be performed at 1,200-1,550° C., inclusive. A crystalline oxide semiconductor thin film obtained by forming this sintered oxide as a sputtering target makes it possible to achieve a carrier density of 1.0×1018 cm?3 or lower, and a carrier mobility of 10 cm2 V?1 sec?1 or higher.

Abstract: Provided are: a sintered oxide which is capable of obtaining low carrier density and high carrier mobility when configured as an oxide semiconductor thin film by using a sputtering method; and a sputtering target which uses the same. The sintered oxide contains indium, gallium and copper as oxides. It is preferable for the gallium content to be 0.20-0.45, inclusive, when expressed as an atomic ratio (Ga/(In+Ga)), the copper content to be at least 0.001 and less than 0.03 when expressed as an atomic ratio (Cu/(In+Ga+Cu)), and for the sintering to be performed at 1,200-1,550° C., inclusive. A crystalline oxide semiconductor thin film obtained by forming this sintered oxide as a sputtering target makes it possible to achieve a carrier density of 3.0×1018 cm?3 or lower, and a carrier mobility of 10 cm2V?1 sec?1 or higher.

Abstract: An oxide sintered body which, when made into an oxide semiconductor thin film by sputtering, can achieve low carrier density and high carrier mobility, and a sputtering target using said oxide sintered body are provided. This oxide sintered body contains indium, gallium and zinc as oxides. The gallium content is 0.08 or more and less than 0.20 in terms of Ga/(In+Ga) atomic ratio, and the zinc content is 0.0001 or more and less than 0.08 in terms of Zn/(In+Ga+Zn) atomic ratio. This crystalline oxide semiconductor thin film is formed with the oxide sintered body as a sputtering target, and can achieve a carrier density of 8.0×1017 cm?3 or less and a carrier mobility of 10 cm2/V·s or greater.

Abstract: An oxide sintered body which, when made into an oxide semiconductor thin film by sputtering, can achieve low carrier density and high carrier mobility, and a sputtering target using said oxide sintered body are provided. This oxide sintered body contains indium, gallium and zinc as oxides. The gallium content is 0.20 or more and 0.49 or less in terms of Ga/(In+Ga) atomic ratio, and the zinc content is 0.0001 or more and less than 0.08 in terms of Zn/(In+Ga+Zn) atomic ratio. This amorphous oxide semiconductor thin film is formed with the oxide sintered body as a sputtering target, and can achieve a carrier density of 4.0×1018 cm?3 or less and a carrier mobility of 10 cm2/V*s or greater.

Abstract: Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an oxide semiconductor thin film by a sputtering method, and a sputtering target which uses the oxide sintered compact. This oxide sintered compact contains, as an oxide, one or more positive divalent elements selected from the group consisting of indium, gallium, nickel, cobalt, calcium, strontium, and lead. The gallium content is less than 0.08 to 0.20 in terms of Ga/(In+Ga) atomic ratio, and the positive dyad (M) content is 0.0001 to 0.05 in terms of M/(In+Ga+M) atomic ratio. In a crystalline oxide semiconductor thin film formed using the oxide sintered compact as a sputtering target, the carrier density is less than 1×1018 cm?3, and the carrier mobility is at least 10 cm2V?1sec?1.

Abstract: Provided is an oxide sintered body that, when used to obtain an oxide semiconductor thin film by sputtering, can achieve a low carrier concentration and a high carrier mobility. Also provided is a sputtering target using the oxide sintered body. The oxide sintered body contains, as oxides, indium, gallium, and at least one positive divalent element selected from the group consisting of nickel, cobalt, calcium, strontium, and lead. The gallium content, in terms of the atomic ratio Ga/(In+Ga), is from 0.20 to 0.45, and the positive divalent element content, in terms of the atomic ratio M/(In+Ga+M), is from 0.0001 to 0.05. The amorphous oxide semiconductor thin film, which is formed using the oxide sintered body as a sputtering target, can achieve a carrier concentration of less than 3.0×1018 cm?3 and a carrier mobility of at least 10 cm2V?1 sec?1.

Abstract: Provided are: a sintered oxide which achieves low carrier density and high carrier mobility when configured as an oxide semiconductor thin-film by using the sputtering method; and a sputtering target using the same. This sintered oxide contains indium, gallium and magnesium as oxides. It is preferable for the gallium content to be 0.20-0.45, inclusive, in terms of an atomic ratio (Ga/(In+Ga)), the magnesium content to be at least 0.0001 and less than 0.05 in terms of an atomic ratio (Mg/(In+Ga+Mg)), and the sintering to occur at 1,200-1,550° C., inclusive. An amorphous oxide semiconductor thin-film obtained by forming this sintered oxide as a sputtering target is capable of achieving a carrier density of less than 3.0×1018cm?3, and a carrier mobility of 10 cm2V?1sec?1 or higher.

Abstract: An oxide sintered body which, when made into an oxide semiconductor thin film by sputtering, can achieve low carrier density and high carrier mobility, and a sputtering target using said oxide sintered body are provided. This oxide sintered body contains indium and gallium as oxides, contains nitrogen, and does not contain zinc. The gallium content in terms of the atomic ratio Ga/(In+Ga) is at least 0.005 but less than 0.20, and substantially no GaN phase is included. Furthermore, the sintered oxide preferably has no Ga2O3 phase. A crystalline oxide semiconductor thin film formed using this oxide sintered body as a sputtering target yields a carrier density of 1.0×1018 cm?3 or less, and a carrier mobility of 10 cm2V?1sec?1 or more.

Abstract: An oxide sintered body which, when made into an oxide semiconductor thin film by sputtering, can achieve low carrier density and high carrier mobility, and a sputtering target using said oxide sintered body are provided. This oxide sintered body contains indium and gallium as oxides, contains nitrogen, and does not contain zinc. The gallium content in terms of the atomic ratio Ga/(In+Ga) is between 0.20 and 0.60, inclusive, and substantially no GaN phase is included. Furthermore, the sintered oxide preferably has no Ga2O3 phase. An amorphous oxide semiconductor thin film formed using this oxide sintered body as a sputtering target yields a carrier density of 3.0×1018 cm?3 or less, and a carrier mobility of 10 cm2 V?1 sec?1 or more.

Abstract: Provided are: a sintered oxide which achieves low carrier density and high carrier mobility when configured as an oxide semiconductor thin-film by using the sputtering method; and a sputtering target using the same. This sintered oxide contains indium, gallium and magnesium as oxides. It is preferable for the gallium content to be at least 0.08 and less than 0.20, inclusive, in terms of an atomic ratio (Ga/(In+Ga)), the magnesium content to be at least 0.0001 and less than 0.05 in terms of an atomic ratio (Mg/(In+Ga+Mg)), and the sintering to occur at 1,200-1,550° C., inclusive. An amorphous oxide semiconductor thin-film obtained by forming this sintered oxide as a sputtering target is capable of achieving a carrier density of less than 1.0×1018 cm?3, and a carrier mobility of 10 cm2 V?1 sec?1 or higher.

Abstract: Provided are: a sintered oxide which is capable of obtaining low carrier density and high carrier mobility when configured as an oxide semiconductor thin film by using a sputtering method; and a sputtering target which uses the same. The sintered oxide contains indium, gallium and copper as oxides. It is preferable for the gallium content to be at least 0.08 and less than 0.20 when expressed as an atomic ratio (Ga/(In+Ga)), the copper content to be at least 0.001 and less than 0.03 when expressed as an atomic ratio (Cu/(In+Ga+Cu)), and for the sintering to be performed at 1,200-1,550° C., inclusive. A crystalline oxide semiconductor thin film obtained by forming this sintered oxide as a sputtering target makes it possible to achieve a carrier density of 1.0×1018 cm?3 or lower, and a carrier mobility of 10 cm V?1sec?1 or higher.

Abstract: Provided are: a sintered oxide which is capable of obtaining low carrier density and high carrier mobility when configured as an oxide semiconductor thin film by using a sputtering method; and a sputtering target which uses the same. The sintered oxide contains indium, gallium and copper as oxides. It is preferable for the gallium content to be 0.20-0.45, inclusive, when expressed as an atomic ratio (Ga/(In+Ga)), the copper content to be at least 0.001 and less than 0.03 when expressed as an atomic ratio (Cu/(In+Ga+Cu)), and for the sintering to be performed at 1,200-1,550° C., inclusive. A crystalline oxide semiconductor thin film obtained by forming this sintered oxide as a sputtering target makes it possible to achieve a carrier density of 3.0×1018 cm?3 or lower, and a carrier mobility of 10 cm2 V?1 sec?1 or higher.

Abstract: The purpose of the present invention is to provide an oxide semiconductor thin film, which has relatively high carrier mobility and is suitable as a channel layer material for a TFT, from an oxynitride crystalline thin film. According to the present invention, a crystalline oxynitride semiconductor thin film is obtained by annealing an amorphous oxynitride semiconductor thin film containing In, O, and N or an amorphous oxynitride semiconductor thin film containing In, O, N, and an additional element M, where M is one or more elements selected from among Zn, Ga, Ti, Si, Ge, Sn, W, Mg, Al, Y and rare earth elements, at a heating temperature of 200° C. or more for a heating time of 1 minute to 120 minutes.