Patents by Inventor Eiichiro Okamoto
Eiichiro Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10713772Abstract: Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.Type: GrantFiled: November 24, 2015Date of Patent: July 14, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto, Kazuya Iwanaga, Ryoji Ikebe
-
Patent number: 9895711Abstract: A substrate liquid processing apparatus including: a substrate rotary-holding unit configured to rotate a substrate while holding the substrate; and a processing liquid supply unit configured to supply a processing liquid to a bottom surface of the substrate held by the substrate rotary-holding unit. The substrate rotary-holding unit includes: a base plate disposed spaced apart from the substrate below the substrate; a cover member supported by the base plate and disposed outside an outer periphery of the substrate; and a discharge port formed between the base plate and the cover member and configured to discharge an air stream occurring below the substrate. The support portion of the base plate and the cover member protrudes outwards from a top surface of the base plate to be connected to the cover member.Type: GrantFiled: January 25, 2016Date of Patent: February 20, 2018Assignee: Tokyo Electron LimitedInventors: Jian Zhang, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
-
Patent number: 9818626Abstract: When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.Type: GrantFiled: October 17, 2013Date of Patent: November 14, 2017Assignee: Tokyo Electron LimitedInventors: Jiro Higashijima, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
-
Patent number: 9793142Abstract: When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.Type: GrantFiled: October 17, 2013Date of Patent: October 17, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Jiro Higashijima, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
-
Patent number: 9782807Abstract: Disclosed is a substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate. The system includes a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle. When it is determined that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.Type: GrantFiled: June 25, 2014Date of Patent: October 10, 2017Assignee: Tokyo Electron LimitedInventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto
-
Patent number: 9536761Abstract: A substrate liquid processing apparatus includes a cup 50 configured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust space 530 in contact with a top opening 50A, and a ring-shaped second exhaust space 540 which is in contact with an exhaust port 52 and is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portion 581 serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.Type: GrantFiled: August 31, 2015Date of Patent: January 3, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto
-
Publication number: 20160221046Abstract: A substrate liquid processing apparatus including: a substrate rotary-holding unit configured to rotate a substrate while holding the substrate; and a processing liquid supply unit configured to supply a processing liquid to a bottom surface of the substrate held by the substrate rotary-holding unit. The substrate rotary-holding unit includes: a base plate disposed spaced apart from the substrate below the substrate; a cover member supported by the base plate and disposed outside an outer periphery of the substrate; and a discharge port formed between the base plate and the cover member and configured to discharge an air stream occurring below the substrate. The support portion of the base plate and the cover member protrudes outwards from a top surface of the base plate to be connected to the cover member.Type: ApplicationFiled: January 25, 2016Publication date: August 4, 2016Inventors: Jian Zhang, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
-
Publication number: 20160148366Abstract: Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.Type: ApplicationFiled: November 24, 2015Publication date: May 26, 2016Inventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto, Kazuya Iwanaga, Ryoji Ikebe
-
Publication number: 20160064256Abstract: A substrate liquid processing apparatus includes a cup 50 configured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust space 530 in contact with a top opening 50A, and a ring-shaped second exhaust space 540 which is in contact with an exhaust port 52 and is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portion 581 serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.Type: ApplicationFiled: August 31, 2015Publication date: March 3, 2016Inventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto
-
Publication number: 20150013722Abstract: Disclosed is a substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate. The system includes a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle. When it is determined that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.Type: ApplicationFiled: June 25, 2014Publication date: January 15, 2015Inventors: Yoshifumi Amano, Yuki Ito, Eiichiro Okamoto
-
Publication number: 20140116480Abstract: When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.Type: ApplicationFiled: October 17, 2013Publication date: May 1, 2014Applicant: Tokyo Electron LimitedInventors: Jiro Higashijima, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito
-
Publication number: 20140116478Abstract: When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.Type: ApplicationFiled: October 17, 2013Publication date: May 1, 2014Applicant: Tokyo Electron LimitedInventors: Jiro Higashijima, Yoshifumi Amano, Eiichiro Okamoto, Yuki Ito