Patents by Inventor Eiichiro Saito

Eiichiro Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11114354
    Abstract: A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: September 7, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Akira Ito, Eiichiro Saito, Kengo Yamanouti
  • Publication number: 20210235580
    Abstract: A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.
    Type: Application
    Filed: April 22, 2019
    Publication date: July 29, 2021
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Akihiro YAMAUCHI, Eiichiro SAITO, Kouichi AOKI
  • Patent number: 10791633
    Abstract: A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 ?m to 630 ?m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 29, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Akira Ito, Eiichiro Saito, Naohito Fukuya
  • Publication number: 20200100370
    Abstract: A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 ?m to 630 ?m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer.
    Type: Application
    Filed: December 18, 2017
    Publication date: March 26, 2020
    Inventors: AKIRA ITO, EIICHIRO SAITO, NAOHITO FUKUYA
  • Publication number: 20190214321
    Abstract: A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from 1/4 to 3/4, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.
    Type: Application
    Filed: August 22, 2017
    Publication date: July 11, 2019
    Inventors: AKIRA ITO, EIICHIRO SAITO, KENGO YAMANOUTI
  • Publication number: 20140243493
    Abstract: A (meth)acrylate resin composition of the present invention contains: a (meth)acrylic resin composition (A) containing a (meth)acrylic acid ester and a poly(meth)acrylic acid ester; and a crosslinking agent (B) containing a bifunctional (meth)acrylic monomer (C) represented by chemical formula 1 and a polyfunctional unsaturated ester compound (D) containing three or more radically polymerizable functional groups. The bifunctional (meth)acrylic monomer (C) is contained in an amount of 2 to 25 parts by mass and the polyfunctional unsaturated ester compound containing three or more radically polymerizable functional groups is contained in an amount of 0.1 to 5 parts by mass, based on 100 parts by mass of the (meth)acrylic resin composition (A).
    Type: Application
    Filed: January 22, 2013
    Publication date: August 28, 2014
    Inventors: Tomoko Ogura, Yoshimitsu Ikoma, Eiichiro Saito
  • Patent number: 7838576
    Abstract: An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics. The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000. [wherein, X is an aryl group; (Y)m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R1 to R3 each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: November 23, 2010
    Assignee: Panasonic Electric Works Co., Ltd
    Inventors: Hiroharu Inoue, Eiichiro Saito, Hiroaki Fujiwara
  • Publication number: 20080254257
    Abstract: An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics. The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000. [wherein, X is an aryl group; (Y)m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R1 to R3 each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 16, 2008
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD
    Inventors: Hiroharu Inoue, Eiichiro Saito, Hiroaki Fujiwara
  • Patent number: 7413791
    Abstract: An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics. The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000. [wherein, X is an aryl group; (Y)m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R1 to R3 each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 19, 2008
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hiroharu Inoue, Eiichiro Saito, Hiroaki Fujiwara
  • Publication number: 20040146692
    Abstract: An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 29, 2004
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Hiroharu Inoue, Eiichiro Saito, Hiroaki Fujiwara
  • Patent number: 6589656
    Abstract: An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: July 8, 2003
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Tetsuya Maekawa, Takao Hayashi, Takeshi Yoshimura, Eiichiro Saito, Kiyotaka Komori
  • Publication number: 20020049264
    Abstract: An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.
    Type: Application
    Filed: July 25, 2001
    Publication date: April 25, 2002
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD.
    Inventors: Tetsuya Maekawa, Takao Hayashi, Takeshi Yoshimura, Eiichiro Saito, Kiyotaka Komori
  • Patent number: 5312651
    Abstract: A method for making a prepreg of an epoxy resin impregnated fiberglass substrate for preparing an electrical laminate provides prolonged shelf life of the prepreg, improved adhesive strength between the prepregs or between a metal foil and the prepreg, and also excellent heat resistance for soldering of the laminate, etc.
    Type: Grant
    Filed: August 24, 1992
    Date of Patent: May 17, 1994
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Toshiharu Takada, Eiichiro Saito
  • Patent number: 5136015
    Abstract: An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: August 4, 1992
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Tatsuo Yonemoto, Masahiro Matsumura, Yoshihisa Sugawa, Eiichiro Saito, Hiroshi Yamamoto, Keiko Kashihara
  • Patent number: 5112989
    Abstract: A process for producing an unsaturated dicarboxylic acid imide compound of formula (I): ##STR1## wherein D represents a divalent organic group having at least one carbon/carbon double bond; R.sup.1 represents an n-valent organic group having at least one carbon atom; and n is an integer of 1 or above, which comprises reacting an unsaturated amide acid compound of formula (II): ##STR2## wherein D, R.sup.1, and n are as defined above, with an orthoester of formula (III): ##STR3## wherein R.sup.2 and R.sup.3, which may be the same or different, each represents a monovalent organic group having at least one carbon atom, to form an unsaturated dicarboxylic acid amide acid ester compound of formula (IV): ##STR4## wherein D, R.sup.1, R.sup.3, and n are as defined above, and then imidating the compound of formula (IV).
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: May 12, 1992
    Assignee: Matsushita Electric Works Ltd.
    Inventors: Tatsuo Yonemoto, Eiichiro Saito, Masahiro Matsumura