Abstract: An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.

Abstract: The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed.

Abstract: An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.

Abstract: A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.