Patents by Inventor Eiitirou Saitou

Eiitirou Saitou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
    Patent number: 7288587
    Abstract: The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: October 30, 2007
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Eiitirou Saitou, Kiyotaka Komori, Naoki Itou
  • Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
    Publication number: 20040132925
    Abstract: The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.
    Type: Application
    Filed: February 11, 2004
    Publication date: July 8, 2004
    Inventors: Eiitirou Saitou, Kiyotaka Komori, Naoki Itou