Patents by Inventor Eiji DEJIMA

Eiji DEJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device
    Patent number: 11862470
    Abstract: An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability, a method for producing the silica particle, a silica sol containing the silica particles, and a polishing composition containing the silica sol. Another object of the present invention is to provide a polishing method, a method for producing a semiconductor wafer, and a method for producing a semiconductor device, which are excellent in productivity of an object to be polished. The silica particle in the present invention satisfies formula (1): y?4.2 where a d value measured by wide-angle X-ray scattering is y ?.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: January 2, 2024
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tomohiro Kyotani, Eiji Dejima, Naoko Sumitani, Tomohiro Kato, Takeshi Sawai
  • SILICA PARTICLE, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20220363554
    Abstract: An object of the present invention is to provide a silica particle, a silica sol containing the silica particle, and a polishing composition containing the silica sol, which prevent secondary aggregation, have excellent dispersion stability, and are suitable for polishing. The present invention relates to a silica particle in which an average value of a circularity coefficient measured by a field-emission scanning electron microscope is 0.90 or more, and a standard deviation of the circularity coefficient is 0.05 or less.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Naoko SUMITANI, Tsutomu YONEMORI, Eiji DEJIMA, Yasuhiro KAWASE
  • SILICA PARTICLE AND PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20210380844
    Abstract: An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability. The present invention relates to a silica particle in which a proportion of silanol groups present on a surface represented by (x/y)×100% is 15% or less, where a content of silanol groups on the surface is x mass % and a content of bulk silanol groups is y mass %.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Tomohiro KYOTANI, Eiji DEJIMA, Naoko SUMITANI, Tomohiro KATO, Takeshi SAWAI
  • SILICA PARTICLE AND PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20210375631
    Abstract: An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability, a method for producing the silica particle, a silica sol containing the silica particles, and a polishing composition containing the silica sol. Another object of the present invention is to provide a polishing method, a method for producing a semiconductor wafer, and a method for producing a semiconductor device, which are excellent in productivity of an object to be polished. The silica particle in the present invention satisfies formula (1): y?4.2 where a d value measured by wide-angle X-ray scattering is y ?.
    Type: Application
    Filed: August 13, 2021
    Publication date: December 2, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Tomohiro KYOTANI, Eiji DEJIMA, Naoko SUMITANI, Tomohiro KATO, Takeshi SAWAI