Patents by Inventor Eiji FUJIKAWA

Eiji FUJIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate
    Patent number: 11961765
    Abstract: The present invention relates to a method for manufacturing a semiconductor substrate, including: (a) preparing an epitaxial substrate having a nitride semiconductor layer formed on a first main surface of a growth substrate and preparing a first support substrate, forming a resin adhesive layer between the first main surface of the growth substrate and a first main surface of the first support substrate, and bonding the epitaxial substrate to the first support substrate; (b) thinning a second main surface of the growth substrate; (c) forming a first protective thin film layer on the thinned growth substrate; (d) forming a second protective thin film layer on the first support substrate; (e) removing the thinned growth substrate; (f) bonding a second support substrate onto the nitride semiconductor layer; and (g) removing the first support substrate and the resin adhesive layer.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: April 16, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuichi Hiza, Kunihiko Nishimura, Masahiro Fujikawa, Yuki Takiguchi, Eiji Yagyu
  • Communication checker, communication-state detection system and method for checking communication state
    Patent number: 8611236
    Abstract: A simple-structure communication checker capable of detecting the communication state of devices communicating in different communication methods is provided. The communication checker includes an SLPR communication detector that detects the communication state through the SLPR service and a FOMA communication detector that detects the communication state through the FOMA service.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: December 17, 2013
    Assignee: Omron Corporation
    Inventors: Akihiko Nakamura, Eiji Fujikawa, Shinichi Mukaigawa
  • Slip-resistant shoe sole
    Publication number: 20090188132
    Abstract: The slip resistant shoe sole 1 of the invention comprises a plurality of ground contact projections 3 formed on the ground contact side of the sole base 2 with a predetermined gap between adjacent ground contact projections 3 in the longitudinal direction of the base 2, the ground contact projections 3 having a V-shaped horizontal cross section, having inclined reinforcements 5 provided at the roots of the ground contact projections 3 on the base 2, and being formed using an elastomeric polymer with a JIS-A hardness of 45 to 80 as measured at 20° C.
    Type: Application
    Filed: February 25, 2005
    Publication date: July 30, 2009
    Applicant: NISSHIN RUBBER Co., LTD
    Inventors: Eiji Fujikawa, Tomohiro Nozaki, Ryuji Harada, Ikumasa Watanabe
  • COMMUNICATION CHECKER, COMMUNICATION-STATE DETECTION SYSTEM AND METHOD FOR CHECKING COMMUNICATION STATE
    Publication number: 20080247328
    Abstract: A simple-structure communication checker capable of detecting the communication state of devices communicating in different communication methods is provided. The communication checker includes an SLPR communication detector that detects the communication state through the SLPR service and a FOMA communication detector that detects the communication state through the FOMA service.
    Type: Application
    Filed: April 1, 2008
    Publication date: October 9, 2008
    Inventors: Akihiko NAKAMURA, Eiji FUJIKAWA, Shinichi MUKAIGAWA