Abstract: In a chamber, first processing is performed as preliminary processing. After the first processing has been finished, the temperature in a predetermined target region in the chamber is measured with a thermographic camera. Then, whether or not to start second processing on a substrate is determined in accordance with the acquired measured temperature information. If it is determined as a result that the second processing can be started, the second processing is performed. In this case, the second processing on the substrate can be started, with the temperature of the target region in the chamber having reached its stability. Accordingly, the second processing can be performed uniformly on a plurality of substrates. That is, it is possible to reduce variations in processing caused by temperature environments in the chamber.

Abstract: A substrate holder holds a substrate at a predetermined position. An etching solution supply unit supplies an etching solution to the substrate at the predetermined position. A rotating unit rotates the substrate holder about a predetermined rotation axis. A temperature distribution acquisition unit acquires the temperature distribution in a peripheral area around the substrate area occupied by the substrate when the substrate is arranged at the predetermined position in a chamber. A feature value calculator calculates, from the temperature distribution, a feature value relating an etching amount of the substrate by the etching using the etching solution.

Abstract: In a chamber, first processing is performed as preliminary processing. After the first processing has been finished, the temperature in a predetermined target region in the chamber is measured with a thermographic camera. Then, whether or not to start second processing on a substrate is determined in accordance with the acquired measured temperature information. If it is determined as a result that the second processing can be started, the second processing is performed. In this case, the second processing on the substrate can be started, with the temperature of the target region in the chamber having reached its stability. Accordingly, the second processing can be performed uniformly on a plurality of substrates. That is, it is possible to reduce variations in processing caused by temperature environments in the chamber.

Abstract: A bevel unit comprises CCDs and processing liquid nozzles, and the CCDs take an image of a circumferential edge surface of a substrate. An image processing part detects the distances between the circumferential edge surface of the substrate and the processing liquid nozzles by image processing the signals from the CCDs. A control unit compares thus detected distances between the circumferential edge surface of the substrate and the processing liquid nozzles with set distances from the circumferential edge surface of the substrate to the processing liquid nozzles which are set in a recipe so as to be a desired rim etching width, and calculates an amount of displacement between the detected distances and the set distances. In accordance with the amount of displacement, the control unit activates motors and accordingly positions the bevel unit.

Abstract: A substrate W rotates about the center of rotations A0 of a spin base 3, while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5. After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A0, a press block 71 pushes this edge surface position to a preset position P1 which is away along the horizontal direction from the center of rotations A0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P1 and positions the center W0 of the substrate within a predetermined range from the center of rotations A0.

Abstract: As a substrate transportation robot transports an unprocessed substrate W to a substrate transfer position P1, inert gas ejected from a substrate floating head 71 toward the bottom surface of the substrate W floats up the unprocessed substrate W. Driven by an actuator 74, the substrate floating head 71 floating up the unprocessed substrate W then moves down. Upon arrival of the unprocessed substrate W at a substrate processing position P3, a bottom rim portion of the substrate W engages with support pins 3, and as the substrate floating head 71 further moves down, the unprocessed substrate W is transferred to and mounted on the support pins 3. The substrate W is thus positioned at the substrate processing position P3, whereby the bottom rim portion of the substrate W and an opposing surface 5b of a spin base 5 are positioned close to each other and opposed against each other.

Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.

Abstract: A transferring apparatus transfers an article to be processed, which is carried by a carrier device, to a holder provided in a processing chamber defined by a processing vessel and adapted to hold the article at a specified processing position. The transferring apparatus includes a temporarily holding member, and transfers the article from the intermediate position to the processing position after receiving the article carried by the carrier device at an intermediate position distanced from the holder and temporarily holding it. The temporarily holding member is retracted to a position in the outside of the processing vessel after the article is transferred.

Abstract: A bevel unit comprises CCDs and processing liquid nozzles, and the CCDs take an image of a circumferential edge surface of a substrate. An image processing part detects the distances between the circumferential edge surface of the substrate and the processing liquid nozzles by image processing the signals from the CCDs. A control unit compares thus detected distances between the circumferential edge surface of the substrate and the processing liquid nozzles with set distances from the circumferential edge surface of the substrate to the processing liquid nozzles which are set in a recipe so as to be a desired rim etching width, and calculates an amount of displacement between the detected distances and the set distances. In accordance with the amount of displacement, the control unit activates motors and accordingly positions the bevel unit.

Abstract: A substrate W rotates about the center of rotations A0 of a spin base 3, while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5. After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A0, a press block 71 pushes this edge surface position to a preset position P1 which is away along the horizontal direction from the center of rotations A0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P1 and positions the center W0 of the substrate within a predetermined range from the center of rotations A0.

Abstract: As a substrate transportation robot transports an unprocessed substrate W to a substrate transfer position P1, inert gas ejected from a substrate floating head 71 toward the bottom surface of the substrate W floats up the unprocessed substrate W. Driven by an actuator 74, the substrate floating head 71 floating up the unprocessed substrate W then moves down. Upon arrival of the unprocessed substrate W at a substrate processing position P3, a bottom rim portion of the substrate W engages with support pins 3, and as the substrate floating head 71 further moves down, the unprocessed substrate W is transferred to and mounted on the support pins 3. The substrate W is thus positioned at the substrate processing position P3, whereby the bottom rim portion of the substrate W and an opposing surface 5b of a spin base 5 are positioned close to each other and opposed against each other.

Abstract: A transferring apparatus transfers an article to be processed, which is carried by a carrier device, to a holder provided in a processing chamber defined by a processing vessel and adapted to hold the article at a specified processing position. The transferring apparatus includes a temporarily holding member, and transfers the article from the intermediate position to the processing position after receiving the article carried by the carrier device at an intermediate position distanced from the holder and temporarily holding it. The temporarily holding member is retracted to a position in the outside of the processing vessel after the article is transferred.

Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.