Patents by Inventor Eiji Hankui

Eiji Hankui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10930989
    Abstract: It has been difficult to suppress electromagnetic wave that propagates within a suspended substrate. The structure according to the present invention is provided with: a first conductor plane and a second conductor plane that are disposed parallel to each other; a dielectric plane that is disposed between the first and second conductor planes via a hollow region so as to be parallel to the first and second conductor planes; a first transmission line disposed on a surface that is of the dielectric plane and that opposes the first conductor plane; and a second transmission line disposed on a surface that is of the dielectric plane and that opposes the second conductor plane, wherein the first transmission line and the second transmission line are electrically connected to each other.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 23, 2021
    Assignee: NEC CORPORATION
    Inventors: Takahide Yoshida, Hiroshi Toyao, Eiji Hankui
  • Publication number: 20200343644
    Abstract: The present invention provides a phase control plate including n layers (n?4) of overlapping admittance sheets (10-1 to 10-6) each of which includes a plurality of plane unit cells, in which an admittance of a first plane unit cell included in an admittance sheet in a layer a (1?a?n) and an admittance of a second plane unit cell being included in an admittance sheet in a layer b (1?b?n and b?a) and overlapping the first plane unit cell are different from each other.
    Type: Application
    Filed: October 23, 2017
    Publication date: October 29, 2020
    Applicant: NEC Corporation
    Inventors: Yoshiaki KASAHARA, Eiji HANKUI, Hiroshi TOYAO, Keishi KOSAKA, Mingqi WU
  • Publication number: 20200295429
    Abstract: It has been difficult to suppress electromagnetic wave that propagates within a suspended substrate. The structure according to the present invention is provided with: a first conductor plane and a second conductor plane that are disposed parallel to each other; a dielectric plane that is disposed between the first and second conductor planes via a hollow region so as to be parallel to the first and second conductor planes; a first transmission line disposed on a surface that is of the dielectric plane and that opposes the first conductor plane; and a second transmission line disposed on a surface that is of the dielectric plane and that opposes the second conductor plane, wherein the first transmission line and the second transmission line are electrically connected to each other.
    Type: Application
    Filed: March 27, 2017
    Publication date: September 17, 2020
    Applicant: NEC Corporation
    Inventors: Takahide YOSHIDA, Hiroshi TOYAO, Eiji HANKUI
  • Publication number: 20200251827
    Abstract: The present invention provides a polarization control plate including n layers (n?4) of overlapping admittance sheets (10-1 to 10-6) each of which includes a plurality of plane unit cells, in which an admittance of a first plane unit cell included in an admittance sheet in a layer a (1?a?n) and an admittance of a second plane unit cell being included in an admittance sheet in a layer b (1?b?n and b?a) and overlapping the first plane unit cell are different from each other, and an admittance of the plane unit cell in an x direction and an admittance of the plane unit cell in a y direction are different from each other.
    Type: Application
    Filed: October 23, 2017
    Publication date: August 6, 2020
    Applicant: NEC Corporation
    Inventors: Yoshiaki KASAHARA, Eiji HANKUI, Hiroshi TOYAO, Keishi KOSAKA, Mingqi WU
  • Patent number: 10411351
    Abstract: To provide a compact antenna capable of corresponding to a plurality of frequency bands. In a first frequency characteristic adjustment unit, the susceptance thereof varies according to a frequency of an input signal. A second frequency characteristic adjustment unit is connected to the first frequency characteristic adjustment unit and the reactance thereof varies according to the frequency of the input signal. A third frequency characteristic adjustment unit is connected to the second frequency characteristic adjustment unit, the susceptance thereof varies according to the frequency of the input signal. A feeding unit is configured to input a signal of any frequency in a plurality of different frequencies to the second frequency characteristic adjustment unit.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: September 10, 2019
    Assignee: NEC CORPORATION
    Inventors: Tomoya Kaneko, Eiji Hankui, Hiroshi Toyao, Keishi Kosaka
  • Publication number: 20180034153
    Abstract: To provide a compact antenna capable of corresponding to a plurality of frequency bands. In a first frequency characteristic adjustment unit, the susceptance thereof varies according to a frequency of an input signal. A second frequency characteristic adjustment unit is connected to the first frequency characteristic adjustment unit and the reactance thereof varies according to the frequency of the input signal. A third frequency characteristic adjustment unit is connected to the second frequency characteristic adjustment unit, the susceptance thereof varies according to the frequency of the input signal. A feeding unit is configured to input a signal of any frequency in a plurality of different frequencies to the second frequency characteristic adjustment unit.
    Type: Application
    Filed: February 1, 2016
    Publication date: February 1, 2018
    Applicant: NEC CORPORATION
    Inventors: Tomoya KANEKO, Eiji HANKUI, Hiroshi TOYAO, Keishi KOSAKA
  • Patent number: 9225049
    Abstract: A noise suppression structure for suppressing an undesired high-frequency current in a transmission line (i.e. a sleeve) of a short-circuited termination type includes a conductor base encompassing the periphery of the transmission line and a conductor short-circuiting part which is connected to the transmission line at the opposite side to an open end of the conductor base and whose inductance is greater than that of the conductor base. It is possible to increase an inductance by modifying the shape of the terminal end of the sleeve, equivalent to a quarter wavelength of an undesired high-frequency current which occurs in a wireless circuit of a mobile wireless terminal and flows through a ground layer, thus reducing the entire length and realizing miniaturization while securing desired input impedance.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: December 29, 2015
    Assignee: NEC CORPORATION
    Inventors: Koichiro Nakase, Eiji Hankui
  • Patent number: 8760117
    Abstract: A battery pack has a case for storing a battery can, and a metal plane made of a conductive material and connected to the battery can in high frequency is provided on the outer circumference plane of the case. A mounting recessed part for removably mounting the battery pack is provided, and a printed circuit board is provided inside. In the mounting recessed part, a plurality of grounding terminals are electrically connected to a grounding layer of the printed circuit board, on an inner plane to which the metal plane of the battery pack abuts. When the battery pack is mounted in the mounting recessed part, electricity is carried between the metal plane and the grounding terminals, and the metal plane and the battery can are grounded to the grounding layer of the printed circuit board in high frequency.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: June 24, 2014
    Assignee: NEC Corporation
    Inventor: Eiji Hankui
  • Publication number: 20140132371
    Abstract: A noise suppression device includes a resonator unit having a plurality of basic resonators each of which is comprised of a resonance pattern with a prescribed resonance length, and a short-circuit pattern for connecting one end of said resonance pattern to a linear pattern, said resonator unit including a basic resonator having a resonance pattern provided on either an upper position and/or lower position relative to the linear pattern and another basic resonator having another resonance pattern provided on either a left position and/or right position relative to the linear pattern.
    Type: Application
    Filed: June 21, 2012
    Publication date: May 15, 2014
    Applicant: NEC CORPORATION
    Inventor: Eiji Hankui
  • Publication number: 20130192865
    Abstract: A noise suppression structure of the present invention includes a current control unit provided on a ground layer and controlling current. The current control unit includes: a metal plane that is provided above the ground layer with an interval therebetween; and a short circuit plate that is arranged at one end portion of the metal plane, and connects the metal plane and the ground layer. A notch portion is provided in a portion of the metal plane.
    Type: Application
    Filed: March 15, 2011
    Publication date: August 1, 2013
    Inventors: Eiji Hankui, Koichiro Nakase, Jun Sakai
  • Patent number: 8379408
    Abstract: Provided are an electromagnetic shield structure capable of reducing the contamination of electromagnetic noise which is radiated from a digital device into a wireless device, and a wireless apparatus using the electromagnetic shield structure. This structure has a shield function to reduce the influence of the noise radiated from an LSI (102), by a first shield (3) and a second shield (4). An open face (4g) of a first L-shaped structure portion (4a) and an open face (4h) of a second L-shaped structure portion (4b) are opposed to each other. Accordingly, even if the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b) are excited by the LSI (102), the electromagnetic fields radiated from the open faces (4g and 4h) cancel each other out to reduce the radiation of noise from the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b).
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: February 19, 2013
    Assignee: NEC Corporation
    Inventor: Eiji Hankui
  • Publication number: 20130015926
    Abstract: A noise suppression structure for suppressing an undesired high-frequency current in a transmission line (i.e. a sleeve) of a short-circuited termination type includes a conductor base encompassing the periphery of the transmission line and a conductor short-circuiting part which is connected to the transmission line at the opposite side to an open end of the conductor base and whose inductance is greater than that of the conductor base. It is possible to increase an inductance by modifying the shape of the terminal end of the sleeve, equivalent to a quarter wavelength of an undesired high-frequency current which occurs in a wireless circuit of a mobile wireless terminal and flows through a ground layer, thus reducing the entire length and realizing miniaturization while securing desired input impedance.
    Type: Application
    Filed: March 25, 2011
    Publication date: January 17, 2013
    Applicant: NEC CORPORATION
    Inventors: Koichiro Nakase, Eiji Hankui
  • Publication number: 20130003321
    Abstract: Provided is a noise suppression structure having a current control unit that controls current, and which is provided on a ground layer. The current control unit comprises: a first metal surface provided on the ground layer with an interval therebetween, and having a first end part and a second end part on the opposite side to the first end part; a second metal surface provided on the first metal surface with an interval therebetween, and having a first end part and a second end part on the opposite side to the first end part; a first short-circuit board disposed on the first end part of the first metal surface, and which connects the first metal surface and the ground layer; and a second short circuit board disposed on the second end part of the second metal surface, and which connects the second metal surface and the first metal surface. A first open end is formed on the second end part of the first metal surface. A second open end is formed on the first end part of the second metal surface.
    Type: Application
    Filed: March 8, 2011
    Publication date: January 3, 2013
    Applicant: NEC CORPORATION
    Inventor: Eiji Hankui
  • Publication number: 20120162040
    Abstract: A mobile wireless terminal is provided which has an antenna constitution that does not have deterioration on a wireless function regardless of when a clamshell type chassis is opened or closed. In such a mobile wireless terminal, a first antenna element is set on a side of a inside surface of a display chassis, and a second antenna element is set on a side of an external surface. A first/second conductive board is arranged so as to face the first/second antenna element. When a display chassis and a main body chassis are in an opened state, both the first and second antennas work which are arranged in the display chassis. When a display chassis and a main body chassis are in a closed state, the second conductive board affects on the second antenna element so as to avoid effects of a metal of the main body chassis, and the second antenna element works without being affected from the metal of the main body chassis.
    Type: Application
    Filed: February 26, 2010
    Publication date: June 28, 2012
    Inventors: Toru Taura, Eiji Hankui, Naoshi Kitamoto
  • Patent number: 8200297
    Abstract: A cellular phone includes upper casing 2 having a front surface with LCD panel 21 disposed thereon, lower casing 3 having a front surface with key pad 22 disposed thereon, and an antenna, upper and lower casings 2, 3 being openably and closably coupled to each other. First control plate 10 for reflecting electromagnetic waves is disposed in upper casing 2, and second control panel 11 for reflecting electromagnetic waves is disposed in lower casing 3. First control plate 10 and second control plate 11 comprise separate members which are independent of each other. When the cellular phone is in an unfolded state in which the angle formed between the front surface of upper casing 2 and the front surface of the lower casing 3 is maximum, first control plate 10 and second control plate 11 have a maximum projected area on the surfaces of upper and lower casings 2, 3.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: June 12, 2012
    Assignee: NEC Corporation
    Inventors: Eiji Hankui, Yukio Yokoyama, Shinya Nakamura, Takuya Kojima
  • Publication number: 20110269512
    Abstract: A battery pack has a case for storing a battery can, and a metal plane made of a conductive material and connected to the battery can in high frequency is provided on the outer circumference plane of the case. A mounting recessed part for removably mounting the battery pack is provided, and a printed circuit board is provided inside. In the mounting recessed part, a plurality of grounding terminals are electrically connected to a grounding layer of the printed circuit board, on an inner plane to which the metal plane of the battery pack abuts. When the battery pack is mounted in the mounting recessed part, electricity is carried between the metal plane and the grounding terminals, and the metal plane and the battery can are grounded to the grounding layer of the printed circuit board in high frequency.
    Type: Application
    Filed: July 1, 2011
    Publication date: November 3, 2011
    Applicant: NEC CORPORATION
    Inventor: Eiji HANKUI
  • Patent number: 7994753
    Abstract: A battery pack has a case for storing a battery can, and a metal plane made of a conductive material and connected to the battery can in high frequency is provided on the outer circumference plane of the case. A mounting recessed part for removably mounting the battery pack is provided, and a printed circuit board is provided inside. In the mounting recessed part, a plurality of grounding terminals are electrically connected to a grounding layer of the printed circuit board, on an inner plane to which the metal plane of the battery pack abuts. When the battery pack is mounted in the mounting recessed part, electricity is carried between the metal plane and the grounding terminals, and the metal plane and the battery can are grounded to the grounding layer of the printed circuit board in high frequency.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: August 9, 2011
    Assignee: Nec Corporation
    Inventor: Eiji Hankui
  • Patent number: 7990747
    Abstract: There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: August 2, 2011
    Assignee: NEC Corporation
    Inventors: Eiji Hankui, Toshihide Kuriyama, Hideki Sasaki, Muneo Fukaishi
  • Publication number: 20110044019
    Abstract: Provided are an electromagnetic shield structure capable of reducing the contamination of electromagnetic noise which is radiated from a digital device into a wireless device, and a wireless apparatus using the electromagnetic shield structure. This structure has a shield function to reduce the influence of the noise radiated from an LSI (102), by a first shield (3) and a second shield (4). An open face (4g) of a first L-shaped structure portion (4a) and an open face (4h) of a second L-shaped structure portion (4b) are opposed to each other. Accordingly, even if the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b) are excited by the LSI (102), the electromagnetic fields radiated from the open faces (4g and 4h) cancel each other out to reduce the radiation of noise from the first L-shaped structure portion (4a) and the second L-shaped structure portion (4b).
    Type: Application
    Filed: December 9, 2008
    Publication date: February 24, 2011
    Inventor: Eiji Hankui
  • Publication number: 20100097159
    Abstract: There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.
    Type: Application
    Filed: February 29, 2008
    Publication date: April 22, 2010
    Inventors: Eiji Hankui, Toshihide Kuriyama, Hideki Sasaki, Muneo Fukaishi