Patents by Inventor Eiji Ichikawa

Eiji Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210227687
    Abstract: A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 22, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kumiko YOSHINAGA, Eiji ICHIKAWA, Hirofumi WATANABE, Mototaka TAKAHASHI
  • Publication number: 20200321839
    Abstract: A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).
    Type: Application
    Filed: December 28, 2018
    Publication date: October 8, 2020
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Tetsurou TATEYAMA, Kumiko YOSHINAGA, Eiji ICHIKAWA, Hirofumi WATANABE, Mototaka TAKAHASHI
  • Patent number: 9480189
    Abstract: A heat-generating component (3) is mounted on a surface (4b), on a case (12) side, of a circuit board (4). A recessed portion (5) is formed in a position facing the heat-generating component (3), on an inner wall surface (12e) side of a bottom wall (12a) of the case (12). Between an inner wall surface (5a) of this recessed portion (5) and the heat-generating component (3), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member (6) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (4b), on the case (12) side, of the circuit board (4) and the inner wall surface (12e) of the bottom wall (12a) of the case (12) on a peripheral edge side of the recessed portion (5).
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: October 25, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshio Kawai, Hironori Ohhashi, Yuuichi Yanagisawa, Kumiko Yoshinaga, Eiji Ichikawa
  • Patent number: 9295175
    Abstract: Disclosed is a seal structure for an electronic control device where a circuit board is accommodated in a housing with a connector attached to the circuit board and held between base and cover members of the housing. The seal structure includes a connector seal surface formed on a front end portion of the base member, a seal material arranged between the connector seal surface and the connector, a seal groove formed in an outer peripheral portion other than the front end portion of the base member, a seal protrusion formed on the cover member and engaged in the seal groove, and a sealant filled between the seal groove and the seal protrusion. Longitudinal end regions of the connector seal surface are extended in a width direction of the connector. Longitudinal end regions of the seal groove are connected perpendicular to the respective end regions of the connector seal surface.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: March 22, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Eiji Ichikawa
  • Publication number: 20150250072
    Abstract: Disclosed is a seal structure for an electronic control device where a circuit board is accommodated in a housing with a connector attached to the circuit board and held between base and cover members of the housing. The seal structure includes a connector seal surface formed on a front end portion of the base member, a seal material arranged between the connector seal surface and the connector, a seal groove formed in an outer peripheral portion other than the front end portion of the base member, a seal protrusion formed on the cover member and engaged in the seal groove, and a sealant filled between the seal groove and the seal protrusion. Longitudinal end regions of the connector seal surface are extended in a width direction of the connector. Longitudinal end regions of the seal groove are connected perpendicular to the respective end regions of the connector seal surface.
    Type: Application
    Filed: February 25, 2015
    Publication date: September 3, 2015
    Inventor: Eiji ICHIKAWA
  • Publication number: 20150216088
    Abstract: A heat-generating component (3) is mounted on a surface (4b), on a case (12) side, of a circuit board (4). A recessed portion (5) is formed in a position facing the heat-generating component (3), on an inner wall surface (12e) side of a bottom wall (12a) of the case (12). Between an inner wall surface (5a) of this recessed portion (5) and the heat-generating component (3), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member (6) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (4b), on the case (12) side, of the circuit board (4) and the inner wall surface (12e) of the bottom wall (12a) of the case (12) on a peripheral edge side of the recessed portion (5).
    Type: Application
    Filed: September 12, 2013
    Publication date: July 30, 2015
    Inventors: Yoshio Kawai, Hironori Ohhhashi, Yuuichi Yanagisawa, Kumiko Yoshinaga, Eiji Ichikawa
  • Patent number: 8797742
    Abstract: An electronic controller for a vehicle includes a circuit board on which an electronic component is mounted and a metal housing accommodating the circuit board therein. The housing includes an inner face and an outer face, at least one of the inner face and the outer face being subjected to surface treatment facilitating heat absorption and dissipation. The inner face of the housing further includes a protruding portion extending to a heating portion of the circuit board so as to be close to the heating portion, or includes concavities and convexities at at least a part thereof opposed to a surface of the circuit board on which the electronic component is mounted so as to increase a surface area of the inner face.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 5, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshio Kawai, Eiji Ichikawa, Takayuki Fukuzawa
  • Publication number: 20110228498
    Abstract: An electronic controller for a vehicle includes a circuit board on which an electronic component is mounted and a metal housing accommodating the circuit board therein. The housing includes an inner face and an outer face, at least one of the inner face and the outer face being subjected to surface treatment facilitating heat absorption and dissipation. The inner face of the housing further includes a protruding portion extending to a heating portion of the circuit board so as to be close to the heating portion, or includes concavities and convexities at at least a part thereof opposed to a surface of the circuit board on which the electronic component is mounted so as to increase a surface area of the inner face.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 22, 2011
    Inventors: Yoshio KAWAI, Eiji ICHIKAWA, Takayuki FUKUZAWA
  • Patent number: 6558920
    Abstract: According to the protein expression system in which a variety of desired useful proteins are highly produced by fusing a coding region of useful protein gene to the downstream of a promoter region of a tyrosinase-encoding gene (melO) of Aspergillus oryzae by a usual method of DNA manipulation, transferring a plasmid containing the resulting novel fusion gene into Aspergillus oryzae and incubating the thus-obtained transformant, various proteins can efficiently be produced at a high purity and in a high yield.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: May 6, 2003
    Assignee: Gekkeikan Sake Company Limited
    Inventors: Yoji Hata, Hiroki Ishida, Hiromoto Hisada, Eiji Ichikawa, Akitsugu Kawato, Yasuhisa Abe, Koji Suginami, Satoshi Imayasu
  • Patent number: 4844911
    Abstract: Alcoholic liquors containing carbamide are treated with the urease which has the optimal pH for the activity in an acid region, especially in the region of pH2 to 5. By such treatment, the carbamide can be completely decomposed and removed from the alcoholic liquors in a much smaller amount of urease and in a short time as compared with a conventional treatment according to a urease having the optimal pH in the neutral to alkaline region. This method is more advantageous from the viewpoint of practical use and the quality of the thus obtained alcoholic liquors are superior to that obtained by the conventional treatment.
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: July 4, 1989
    Assignees: Takeda Chemical Industries, Gekkeikan Sake Company, Ltd.
    Inventors: Shigeya Kakimoto, Yasuhiro Sumino, Hideaki Yamada, Satoshi Imayasu, Eiji Ichikawa, Tetsuyoshi Suizu