Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.

Abstract: An electronic component that includes a base body and insulating film covering an outer surface of the base body. The outer surface has a first boundary surface including a curved surface that is present at a boundary between a first surface and a second surface of the outer surface. An inner angle of the base body among angles formed by the first surface and the second surface is less than 180 degrees. The average value of a thickness dimension from the first boundary surface to the surface of an insulating film portion covering the first boundary surface is greater than the average value from the first surface to the surface of an insulating film portion covering the first surface in the thickness direction.

Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder.

Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.

Abstract: An inductor in which the external electrode is constituted by a conductive resin layer formed on a surface of a core effectively prevents peeling between the core and the external electrode. The inductor includes a core containing magnetic particles and a resin, a conductor embedded in the core, a conductive resin layer disposed on a surface of the core so as to be in contact with an end portion of the conductor exposed from the core, and a plating layer formed on the conductive resin layer. The plating layer is formed so as to extend to the surface of the core beyond a range in which the conductive resin layer is disposed.

Abstract: An inductor includes a body containing soft magnetic powder and resin, a coil embedded in the body, outer electrodes on the body, and a protective film on the surface of the body. The protective film has a thickness of 10 ?m or more and contains silica particles and resin. In the protective film, the silica particles have an average diameter of 15 nm to 75 nm, and the percentage by weight of the silica particles to the resin is between 150% and 250%.

Abstract: A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

Abstract: In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

Abstract: An electronic component includes at least one coil including a winding part and lead-out end parts at both ends thereof, and a magnetic molded body having a mounting surface with the coil incorporated therein. The lead-out end parts are led out toward the mounting surface such that end surfaces of the lead-out end parts are arranged on the same plane as the mounting surface.

Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder.

Abstract: A surface-mount inductor includes a coil formed by winding a conductor, a molded body made of a sealing material containing a metal magnetic material and a resin with the coil enclosed therein, and an external terminal connected to the coil. The molded body has, in a surface perpendicular to a coil axis of the coil, a first region having a filling factor of the metal magnetic material lower than an average filling factor of the metal magnetic material in the whole of the molded body. The external terminal is disposed on a region at least including the first region.

Abstract: An electronic component includes at least one coil including a winding part and lead-out end parts at both ends thereof, and a magnetic molded body having a mounting surface with the coil incorporated therein. The lead-out end parts are led out toward the mounting surface such that end surfaces of the lead-out end parts are arranged on the same plane as the mounting surface.

Abstract: A surface-mount inductor includes a coil formed by winding a conductor, a molded body made of a sealing material containing a metal magnetic material and a resin with the coil enclosed therein, and an external terminal connected to the coil. The molded body has two parallel surfaces and has, in at least one of the surfaces, a first region having a filling factor of the metal magnetic material higher than an average filling factor of the metal magnetic material in the whole of the molded body. The external terminal is disposed on a region at least including the first region.

Abstract: A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.