Abstract: The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

Abstract: A carrier band of electronic parts which can carry electronic parts such as IC packages in good protected condition without spoiling the convenience of a carrier tape having convexities and sticking tape.

Abstract: The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

Abstract: The present invention relates to improvement in a working apparatus, such as an electronic part automatic-mounting apparatus comprising carriers for holding and moving works on a working line and a work head for applying a predetermined operation at a predetermined position on the work moved by the carriers, to a work station. The apparatus also includes: head driving means for moving the work head in directions (for examples, a Y direction) different from the moving direction of the work (for example, an X direction) and carrier driving means for moving the carriers along the working line sequentially from a work feed position to a work station, onto a work discharge position and then moving or restoring the work back to the work feed position (7). The carrier driving means also position the point of operation on the work in the moving direction fo the work at the work station.

Abstract: A part such as electronic parts is irradiated by diffused light and a silhouette of the parts is sensed by an image sensor, and plural optical systems are placed between the parts and the image sensor, and thereby the silhouette of the parts is divided into plural portions, moreover a shutter having plural openings is provided between the image sensor and the optical system to select one of the plural optical systems; thus one of respective silhouettes of the plural portions is sensed by the image sensor, and the portions are sensed in turn by shifting the shutter.

Abstract: Fabrication of an electronic circuit board is carried out by forming a predetermined number of resistors having various resistances based on a circuit design stored in a memory on a nonconductive substrate and dividing the nonconductive substrate into discrete resistors, then mounting the discrete resistors on a circuit board and testing operation characteristic thereof; and when some resistors having resistances which are not suitable to obtain a predetermined operation characteristic exist in the above-formed resistors, the resistances are corrected, and electronic circuit board having corrected accurate electric constants is obtained; and thereby a complete electronic circuit boards are fabricated by repetition of above-mentioned respective steps.

Abstract: An electronic component mounting device for mounting an electronic component onto a circuit-board, is provided with an intermittently rotatable rotary frame, a plurality of elevating members disposed around and along the periphery of the rotary frame at regular intervals so as to be free to move up and down, a plurality of electronic component holding members respectively securely mounted on the elevating members each to hold one electronic component at a time, an index unit for controlling the intermittent rotation of the rotary frame by way of a shaft, a cam mechanism for moving the elevating members up and down with the rotation of the rotary frame, and an operating member for moving any one of the electronic component holding members up and down.

Abstract: In the mounting of an electronic component, a holding member is rotated by a predetermined angle prior to actual holding of the electronic parts, thereby to detect a center of the holding member from at least two positions of the rotation angle, and the rotation center of the holding member is found by a calculation based on the detected center of the holding member. The position of the electronic parts against a circuit board then is corrected on the basis of a deviation between the position of the rotation center and the center of the holding member.

Abstract: The present invention is a part mounting device for mounting chip parts on a substrate, comprising a linear motor having a columnar yoke with upper and lower ends thereof pivotably supported on the device, permanent magnets disposed in the vicinity of the columnar yoke and forming with the columnar yoke a magnetic circuit, and a bobbin disposed in the vicinity of the columnar yoke and slidable in the columnar direction of the yoke;a chip part holder fixedly secured to the bobbin and having a vacuum nozzle for picking up and holding chip parts;a mechanism connected to said linear motor for controlling the driving of the linear motor for driving the part holder rapidly for moving chip parts quickly from a first position remote from the position of the substrate on which the chip parts are to be mounted to a third position just before the chip parts are on the substrate and then driving the part holder slowly to move the chip parts from the third position to a second position where the chip parts are on the subs

Abstract: A method of optical recognition of a component suction-gripped by a suction nozzle, wherein, when a small component (P) is illuminated by a first illuminator (23), from cone-shaped reflector provided on the base part of a sucking nozzle (3), thereby making a silhouette image of the small component, and when a large component (P') is suction-gripped, a second illuminator, having two-piece movable translucent sheets (25a+25b, which are opened to pass the large component (P') through a thus-opened gap, illuminates the large component (P') to make its silhouette image. By using a lightweight nozzle, a silhouette of the large component is obtainable, assuring high speed mounting of components.

Abstract: The present invention relates to a method and apparatus for mounting an electronic part (11) on a circuit board (28). When the part is mounted, a distance between the under surface of a part maintaining section (12) and the circuit board (38) is measured. Determination that the electronic part (11) is normally mounted on the circuit board (28) is made by comparing the measured distance with the thickness of the electronic part (11) measured in advance.

Abstract: An electronic component transporting apparatus employing taping cassettes includes a toothed wheel arranged for meshing engagement within successive compartments of a taping cassette after a sealing tape has been stripped from the taping cassette and components contained in compartments thereof have been successively removed, whereby stepwise rotation of the toothed wheel is utilized to produce stepwise advancement of the taping cassette for successive removal of electronic components contained in the compartments. Since it is not necessary to provide a line of perforations along an elongated side of each taping cassette, for use in driving the cassette, each cassette can be made substantially smaller in width than has been possible in the prior art.

Abstract: A moving table type work system includes a work table (3) arranged to provide the movements of two degrees of freedom for a work piece (a) to carry out a predetermined work for the work piece (a). Further included are a feeding table (1) which is reciprocated between the work table (3) and a work piece feeding device (2) to transfer the work piece (a) from the work piece feeding device (2) to the work table (3) and a discharging table (4) which is also reciprocated between the work table (3) and a work piece receiving device (5) to transfer the work piece (a) from the work table (3) to the work piece receiving device (5).

Abstract: According to this invention, an electrically conducting wire provided with a solder ball is inserted through throughholes provided around the perimeters thereof with electrically conductive members such as copper foils which form printed wiring on both surfaces of an insulating substrate. One of the conductive members and the conducting wire are soldered by dipping or flow-soldering, thereby making a circuit connection across both surfaces of the substrate by causing melting of the solder ball on the conducting wire on the substrate surface not soldered.

Abstract: A component mounting apparatus comprises a hollow rod communicated to a source of vacuum and having a suction head for picking up generally rectangular articles one at a time by the effect of a suction force. At least one pair of finger members for clamping and releasing the articles which has been sucked onto the suction head are provided for effecting a correction in position of the article relative to the suction head. Each of the finger members has an inclined end face which is adapted to support the article sucked onto the suction head from below in engagement with the opposite lower edges of the article.

Abstract: The disclosure is directed to an electronic component supply apparatus for use in an electronic component mounting arrangement, which employs an electronic component carrier tape. The apparatus is arranged to separate a covering tape from a tape base of the carrier tape only at a position directly below a vacuum chuck for picking up the component, while the covering tape is separated from the tape base so as to be wound up at a winding speed lower than an intermittent feeding speed of the carrier tape by a predetermined pitch.

Abstract: Assembly devices for electrical circuit components which is suitable for feeding electronic chip components, especially for semiconductor IC chips with comb-like leads, to e.g. chip mounting apparatuses, comprises two belt-like long objects made of tape-like and belt-shaped long materials, and is capable of feeding the electronic chip components mounted thereon in a stable and continuous feeding operation.

Abstract: A jig for checking space for machine insertion of electronic components with parallel lead wires on a printed substrate, comprising:a pair of space detection levers 11,11' at the lower part,a pair of component-holding levers 10,10' at the upper part,the detection levers 11,11' and the holding levers 10,10' being opposite ends of crosswisely disposed levers 7,7 pivotted at middle parts thereof by pivotting pins 9,9' on a frame 1, so that, when an electronic component 3 is held by the part holding levers 10,10', the outside of the detection levers indicates a size of space necessary for inserting operation of an insertion head of a machine, anda pair of guide pins 2,2 fixed on a narrowed bottom face of a below extended member 101 of the frame 1;a space checking is made by holding the electronic component 3 with and between the component-holding levers 10,10' and by inserting the guide pins 2,2 into insertion holes for lead wires of a printed substrate.