Abstract: Provided is an integrated dicing die bonding sheet having excellent storage stability and stress relaxation properties, having no problems such as chip flying, chipping, cracking, and the like during a dicing process, and having excellent production efficiency; and a method of manufacturing a semiconductor device (particularly including a MEMS device) using the same. An integrated dicing die bonding sheet including a base film, and a silicone-based adhesive sheet having an adhesive surface adhered to the semiconductor wafer, wherein at a stage after dicing the semiconductor wafer and prior to heating, the base film can be interfacially peeled from the silicone-based adhesive sheet, and after the adhesive surface is heated within a range of 50 to 200° C., a peeling mode of the adhesive surface from another non-pressure-sensitive adhesive base material changes to cohesive failure, exhibiting permanent adhesion.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: An organic silicon compound is disclosed which is represented by a formula: (R13SiO)3SiR2—[SiR32O]y[SiR32]w—R4—R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Abstract: An organic silicon compound is disclosed which is represented by a formula : (R13SiO)3SiR2-[SiR32O]y[SiR32]w-R4-R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.

Abstract: There is provided a polyester coating composition having excellent action of preventing deposition of outdoor stain and stain caused by rainfall, being capable of extending a period of time (pot life) from the mixing to the coating, and comprising (A) a polyester resin, (B) one or more of fluorine-containing organosilicon compounds having a fluorine content of 5 to 30% by mass, (C) one or more of aliphatic hydrocarbon compounds having hydroxyl group and 1 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms and/or one or more of alkoxy compounds having 2 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms, and (D) an organic solvent.

Abstract: There is provided a curable fluorine-containing polymer composition which is rapidly cured at relatively low temperature by hydrosilylation reaction to form a coating film having not only high hardness and flexibility but also water- and oil-repellency, thereby giving stain-proofing effect for a long period of time, especially maintaining property of removing and wiping-off stain.

Abstract: A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.

Abstract: A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.

Abstract: A curable polymer composition that is quickly curable to form a cured article having excellent adhesion and followability to a substrate and at least including (A) an acrylic copolymer having a hydrogen atom bonded to a silicon atom, (B) a compound having at least two aliphatic unsaturated bonds in one molecule thereof, (C) a fluoroolefin copolymer including vinylidene fluoride as main component, and (D) a catalyst for hydrosilylation reaction.

Abstract: There is provided a curable fluorine-containing polymer composition which is rapidly cured at relatively low temperature by hydrosilylation reaction to form a coating film having not only high hardness and flexibility but also water- and oil-repellency, thereby giving stain-proofing effect for a long period of time, especially maintaining property of removing and wiping-off stain.

Abstract: There is provided a polyester coating composition having excellent action of preventing deposition of outdoor stain and stain caused by rainfall, being capable of extending a period of time (pot life) from the mixing to the coating, and comprising (A) a polyester resin, (B) one or more of fluorine-containing organosilicon compounds having a fluorine content of 5 to 30% by mass, (C) one or more of aliphatic hydrocarbon compounds having hydroxyl group and 1 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms and/or one or more of alkoxy compounds having 2 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms, and (D) an organic solvent.

Abstract: There is provided a curable polymer composition being curable quickly to form a cured article having excellent adhesion and followability to a substrate and at least comprising (A) an acrylic copolymer having a hydrogen atom bonded to a silicon atom, (B) a compound having at least two aliphatic unsaturated bonds in one molecule thereof, (C) a fluoroolefin copolymer comprising vinylidene fluoride as main component, and (D) a catalyst for hydrosilylation reaction.

Abstract: A magnetic recording medium comprises a light-shielding base in the form of a tape or sheet, and a magnetic layer composed of a magnetic powder of Co-coated .gamma.-Fe.sub.2 O.sub.3 dispersed in a resin binder and applied to the base. The powder has a specific surface area as determined by the BET adsorption method of at least 35 m.sup.2 /g. The light-shielding base portion contiguous to the magnetic layer is a transparent plastic film and the lower base portion is light-shielding. The light-shielding base has a light transmittance of 30% or below. The surface roughness of the base is, in terms of the center-line average surface roughness, 0.012 .mu.m or below.