Abstract: A connector includes a female member, and a checking member. The female member has a housing being provided with paired windows. The checking member is assembled outward with and retained onto the housing from the axially perpendicular direction, and has a letter “C”-shaped portion and paired locker protrusions. The locker protrusions have a first locker, a leading-end contact, and an inclined second locker, respectively. The first lockers inhibit an assembly-line worker or robot from pulling the checking member from out of the housing. The leading-end contacts expand the letter “C”-shaped portion diametrically when a male member is inserted into the female member completely. The inclined second lockers inhibit elastic force, which arises in the letter “C”-shaped portion, from removing the checking member from the housing. The housing further has a fitting dent. The checking member's letter “C”-shaped portion has a fitting protrusion that fits into the fitting dent.

Abstract: Provided is a rubber composition, which is excellent in fuel permeation resistance, and is capable of achieving improvements in low-temperature embrittlement property and solvent crack property. The rubber composition includes: a fluororubber having a fluorine concentration content of 70 to 71 wt % as a main component; a crosslink-type agent; and the following components (A) and (B), in which: the total content [(A)+(B)] of the above-mentioned components (A) and (B) falls within the range of 17 to 25 parts by weight with respect to 100 parts by weight of the above-mentioned fluororubber; and a weight ratio (A)/(B) of the content of the above-mentioned component (A) to the content of the above-mentioned component (B) falls within the range of 2.0/1 to 3.0/1: (A) barium sulfate; and (B) a neutral silica.

Abstract: Provided is a rubber composition, which is excellent in fuel permeation resistance, and is capable of achieving improvements in low-temperature embrittlement property and solvent crack property. The rubber composition includes: a fluororubber having a fluorine concentration content of 70 to 71 wt % as a main component; a crosslink-type agent; and the following components (A) and (B), in which: the total content [(A)+(B)] of the above-mentioned components (A) and (B) falls within the range of 17 to 25 parts by weight with respect to 100 parts by weight of the above-mentioned fluororubber; and a weight ratio (A)/(B) of the content of the above-mentioned component (A) to the content of the above-mentioned component (B) falls within the range of 2.0/1 to 3.0/1: (A) barium sulfate; and (B) a neutral silica.

Abstract: A connector includes a female member, and a checking member. The female member has a housing being provided with paired windows. The checking member is assembled outward with and retained onto the housing from the axially perpendicular direction, and has a letter “C”-shaped portion and paired locker protrusions. The locker protrusions have a first locker, a leading-end contact, and an inclined second locker, respectively. The first lockers inhibit an assembly-line worker or robot from pulling the checking member from out of the housing. The leading-end contacts expand the letter “C”-shaped portion diametrically when a male member is inserted into the female member completely. The inclined second lockers inhibit elastic force, which arises in the letter “C”-shaped portion, from removing the checking member from the housing. The housing further has a fitting dent. The checking member's letter “C”-shaped portion has a fitting protrusion that fits into the fitting dent.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof is disclosed. The printed circuit board manufacturing method includes the steps of: forming inner layer conductor circuits 32A on a core substrate 30; forming a recess part 31 on the core substrate 30; housing, in a recess part 31, a planar capacitor device 20 that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin 43 and conductor metal foil 44 to heat pressurize the same for forming a multi-layer plate; forming via holes 41A for electrically connecting an outer layer conductor circuit 42A to the electrodes 21,22 of the capacitor device 20; forming a conductor layer on them; and forming the outer layer conductor circuits 42A on the surfaces of the multi-layer plate.

Abstract: A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Abstract: A method for designing a circuit on a spherical shaped semiconductor device using a great circle and a small, which is either parallel or perpendicular to the great circle, to define critical dimensions needed for the circuit. A great-circle-small-circle framework is used that has at least one great circle and one small circle that define a critical dimension on the surface of the sphere.

Abstract: A method for designing a circuit on a spherical shaped semiconductor integrated circuit using uniform unit shapes capable of cover the surface of the sphere in a matingly corresponding orientation with adjacent unit shapes. The method includes the steps of designing a circuit within each unit shape selected from various types of unit shape patterns; selecting a predetermined number of those unit shapes from the various types of unit shape patterns; and covering the spherical integrated circuit with the predetermined number of unit shapes. Furthermore, the designer can use the unit shapes to navigate over the surface to accurately determine the location, the position, and surface area remaining.