Patents by Inventor Eiji Mugiya

Eiji Mugiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9807916
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 31, 2017
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo Kitazaki, Masaya Shimamura, Eiji Mugiya, Takehiko Kai
  • Patent number: 9560740
    Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: January 31, 2017
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Eiji Mugiya, Masaya Shimamura
  • Patent number: 9456488
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaya Shimamura, Takehiko Kai, Eiji Mugiya, Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9455209
    Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Eiji Mugiya, Masaya Shimamura, Kenzo Kitazaki, Takehiko Kai
  • Publication number: 20160095267
    Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
    Type: Application
    Filed: September 22, 2015
    Publication date: March 31, 2016
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Eiji MUGIYA, Masaya SHIMAMURA
  • Patent number: 9101044
    Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Yutaka Nagai, Hiroshi Nakamura, Tetsuo Saji, Eiji Mugiya
  • Patent number: 9101050
    Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Eiji Mugiya, Tatsuro Sawatari, Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9055682
    Abstract: There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: June 9, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Eiji Mugiya, Kenzo Kitazaki, Masaya Shimamura
  • Patent number: 9018039
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: April 28, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Eiji Mugiya, Takehiko Kai, Masaya Shimamura, Tetsuo Saji, Hiroshi Nakamura
  • Publication number: 20150070851
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo KITAZAKI, Masaya SHIMAMURA, Eiji MUGIYA, Takehiko KAI
  • Publication number: 20150070849
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Takehiko KAI, Eiji MUGIYA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150062835
    Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.
    Type: Application
    Filed: December 10, 2013
    Publication date: March 5, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Takehiko KAI, Eiji MUGIYA, Masaya SHIMAMURA, Kenzo KITAZAKI, Hiroshi NAKAMURA, Tetsuo SAJI
  • Publication number: 20150049439
    Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
    Type: Application
    Filed: November 26, 2013
    Publication date: February 19, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Kenzo KITAZAKI, Eiji MUGIYA, Tatsuro SAWATARI, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150043189
    Abstract: A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.
    Type: Application
    Filed: December 10, 2013
    Publication date: February 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo KITAZAKI, Masaya SHIMAMURA, Eiji MUGIYA, Takehiko KAI
  • Publication number: 20150043171
    Abstract: There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.
    Type: Application
    Filed: November 21, 2013
    Publication date: February 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Eiji MUGIYA, Kenzo KITAZAKI, Masaya SHIMAMURA
  • Publication number: 20150043172
    Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
    Type: Application
    Filed: December 11, 2013
    Publication date: February 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Eiji MUGIYA, Kenzo KITAZAKI, Masaya SHIMAMURA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150044822
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 12, 2015
    Inventors: Eiji MUGIYA, Takehiko KAI, Masaya SHIMAMURA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150043170
    Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
    Type: Application
    Filed: November 21, 2013
    Publication date: February 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Kenzo KITAZAKI, Yutaka NAGAI, Hiroshi NAKAMURA, Tetsuo SAJI, Eiji MUGIYA
  • Publication number: 20150016066
    Abstract: A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface.
    Type: Application
    Filed: February 27, 2014
    Publication date: January 15, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Eiji MUGIYA, Kenzo KITAZAKI, Takehiko KAI, Masafumi Imai, Atsushi ITO
  • Patent number: 8897019
    Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 25, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Eiji Mugiya, Tetsuo Saji, Atsushi Tsunoda, Hiroshi Nakamura