Patents by Inventor Eiji Mukai

Eiji Mukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5771158
    Abstract: The signal connecting through vias are provided on an edge side of a multilayer printed circuit board along a longitudinal direction thereof, and the signal wiring of the respective layers of the signal wiring layer is inclined with respected to the arrangement of the through vias.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: June 23, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Keitarou Yamagishi, Akio Gotoh, Akihiro Miura, Eiji Mukai, Eishi Gofuku