Patents by Inventor Eiji Nakamura

Eiji Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240064402
    Abstract: The technology relates to an imaging apparatus, an imaging control method, and a program for resuming tracking from an appropriate position at an end of tracking. The imaging apparatus includes a focus control section configured to control a tracking function of tracking a tracking target and keeping the tracking target in focus, and a setting section configured to move a tracking start position during tracking on the basis of a predetermined condition. The technology may be applied, for example, to the imaging apparatus having the tracking function.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 22, 2024
    Inventors: Takahiro Sato, Yu Kimishima, Yohei Takada, Takayuki Hosokawa, Akira Fukuda, Eiji Nakamura, Terutoshi Nakagawa, Makoto Kurahashi, Akiko Yoshimoto
  • Patent number: 11720801
    Abstract: A technique for performing a function by utilizing chemical reactions is disclosed. In the technique, solution including an input chemical species having a concentration is provided. A chemical reaction network that includes at least a sequence of chemical reactions starting with the input chemical species to generate a plurality of output chemical species is also prepared. The solution is exposed to the chemical reaction network to present a pattern formed by the plurality of output chemical species depending on the concentration of the input chemical species.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: August 8, 2023
    Assignee: International Business Machines Corporation
    Inventors: Eiji Nakamura, Toshiyuki Yamane, Koji Masuda
  • Publication number: 20230241700
    Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 3, 2023
    Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
  • Patent number: 11684988
    Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: June 27, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
  • Patent number: 11660026
    Abstract: Embodiments are disclosed for a method for restoring a wearable biological sensor. The method includes determining that a wearable biological marker sensor comprising a reference electrode is placed within a restoration apparatus. The restoration apparatus includes a correct reference electrode, a counter electrode, and a chloride solution. The reference electrode is in electrical contact with the correct reference electrode and the counter electrode through the chloride solution. The method additionally includes determining whether the reference electrode is degraded based on a voltage differential between the reference electrode and the correct reference electrode. The method also includes restoring the reference electrode, if the reference electrode is degraded, by applying a voltage to a circuit. The circuit includes the reference electrode and the counter electrode. Further, multiple chloride ions of the chloride solution bond with a plurality of silver atoms of the reference electrode.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: May 30, 2023
    Assignee: International Business Machines Corporation
    Inventors: Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch, Hiroyuki Mori
  • Publication number: 20230105932
    Abstract: A surface coated cutting tool includes a tool substrate; and a hard coating layer on the tool substrate. The hard coating layer includes, in sequence from the tool substrate toward a surface of the tool, a titanium carbonitride inner layer, a titanium nitride lower intermediate layer, a titanium carbonitride upper intermediate layer, a titanium oxycarbonitride bonding auxiliary layer, and an aluminum oxide outer layer. Titanium nitride grain boundaries in the lower intermediate layer and titanium carbonitride grain boundaries in the upper intermediate layer are continuous from titanium carbonitride grain boundaries in the inner layer. The texture coefficient TC(422) of titanium carbonitride in the inner layer and the upper intermediate layer is 3.0 or more, and the texture coefficient TC(0 0 12) of ?-aluminum oxide in the outer layer is 5.0 or more.
    Type: Application
    Filed: June 5, 2020
    Publication date: April 6, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Eiji Nakamura, Mitsuhiro Abe, Kazuhiro Kawano
  • Publication number: 20220193805
    Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
  • Patent number: 11329018
    Abstract: A technique for fabricating a bump structure is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared, in which the pads includes first conductive material. A metallic adhesion layer is coated on each pad. A bump base is formed on each pad by sintering conductive particles using a mold layer, in which the conductive particles includes second conductive material different from the first conductive material.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 10, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Takashi Hisada, Toyohiro Aoki, Eiji Nakamura
  • Patent number: 11298769
    Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: April 12, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toyohiro Aoki, Eiji Nakamura, Takashi Hisada
  • Publication number: 20220064700
    Abstract: A technique for performing a function by utilizing chemical reactions is disclosed. In the technique, solution including an input chemical species having a concentration is provided. A chemical reaction network that includes at least a sequence of chemical reactions starting with the input chemical species to generate a plurality of output chemical species is also prepared. The solution is exposed to the chemical reaction network to present a pattern formed by the plurality of output chemical species depending on the concentration of the input chemical species.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 3, 2022
    Inventors: Eiji Nakamura, Toshiyuki Yamane, Koji Masuda
  • Patent number: 11181704
    Abstract: A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: November 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Masao Tokunari
  • Patent number: 11164845
    Abstract: A method for fabricating a resist structure is presented. The method includes preparing a substrate on which plural conductive pads are formed; and patterning a lower resist to form plural lower cavities. The lower resist is deposited above the substrate. Each of the plural lower cavities are located above a corresponding one of the plural conductive pads. Additionally, the method includes patterning an upper resist to form plural upper cavities. The upper resist is deposited on the lower resist. Each of the plural upper cavities are located on a corresponding one of the plural lower cavities and have a diameter larger than a diameter of the corresponding one of the plural lower cavities.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: November 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eiji Nakamura, Toyohiro Aoki, Takashi Hisada, Risa Miyazawa
  • Patent number: 11112570
    Abstract: A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: September 7, 2021
    Assignee: International Business Machines Corporation
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Masao Tokunari
  • Publication number: 20210263384
    Abstract: This display apparatus comprises: a plurality of pixels arrayed along a plurality of rows and a plurality of columns; a plurality of signal lines connected to the plurality of pixels respectively for each row; a drive circuit for generating a plurality of control signals to selectively turn the plurality of pixels on and off by rows, the drive circuit applying the control signals to the signal lines; a power supply circuit for supplying the drive circuit with a voltage for generating each control signal; and at least one inductor connected between the power supply circuit and the plurality of signal lines.
    Type: Application
    Filed: June 29, 2018
    Publication date: August 26, 2021
    Inventor: EIJI NAKAMURA
  • Publication number: 20210242164
    Abstract: A method for fabricating a resist structure is presented. The method includes preparing a substrate on which plural conductive pads are formed; and patterning a lower resist to form plural lower cavities. The lower resist is deposited above the substrate. Each of the plural lower cavities are located above a corresponding one of the plural conductive pads. Additionally, the method includes patterning an upper resist to form plural upper cavities. The upper resist is deposited on the lower resist. Each of the plural upper cavities are located on a corresponding one of the plural lower cavities and have a diameter larger than a diameter of the corresponding one of the plural lower cavities.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 5, 2021
    Inventors: Eiji Nakamura, Toyohiro Aoki, Takashi Hisada, Risa Miyazawa
  • Publication number: 20210145325
    Abstract: Embodiments are disclosed for a method for restoring a wearable biological sensor. The method includes determining that a wearable biological marker sensor comprising a reference electrode is placed within a restoration apparatus. The restoration apparatus includes a correct reference electrode, a counter electrode, and a chloride solution. The reference electrode is in electrical contact with the correct reference electrode and the counter electrode through the chloride solution. The method additionally includes determining whether the reference electrode is degraded based on a voltage differential between the reference electrode and the correct reference electrode. The method also includes restoring the reference electrode, if the reference electrode is degraded, by applying a voltage to a circuit. The circuit includes the reference electrode and the counter electrode. Further, multiple chloride ions of the chloride solution bond with a plurality of silver atoms of the reference electrode.
    Type: Application
    Filed: November 20, 2019
    Publication date: May 20, 2021
    Inventors: Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch, HIROYUKI MORI
  • Patent number: 11008983
    Abstract: An EGR gas distributor for distributing EGR gas to each of branch pipes of an intake manifold includes a gas chamber, a gas inflow passage, and a plurality of gas distribution passages. The inner wall of the gas chamber on a downstream side is divided into a plurality of downstream divided walls corresponding to the gas distribution passages. On the boundary between adjacent two of the downstream divided walls, a downstream ridge is provided in a perpendicular direction to the arrangement direction of the gas distribution passages. The downstream ridges are arranged side by side in number corresponding to the number of gas distribution passages. The downstream ridges each include a side surface in the arrangement direction. The downstream ridges are different in at least one of height and inclination angle of the side surface according to the positions of the downstream ridges.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: May 18, 2021
    Assignee: AISAN KOGYO KABUSHIKI KAISHA
    Inventors: Mamoru Yoshioka, Kaisho So, Eiji Nakamura
  • Publication number: 20210125950
    Abstract: A technique for fabricating a bump structure is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared, in which the pads includes first conductive material. A metallic adhesion layer is coated on each pad. A bump base is formed on each pad by sintering conductive particles using a mold layer, in which the conductive particles includes second conductive material different from the first conductive material.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 29, 2021
    Inventors: Takashi Hisada, Toyohiro Aoki, Eiji Nakamura
  • Patent number: 10991685
    Abstract: A technique of assembling a plurality of chips is disclosed. A plurality of chip layers, each of which includes at least one chip block, is prepared. Each chip block includes a plurality of electrodes assigned the same function. The plurality of the chip layers is sequentially stacked with rotation so as to configure at least one stack of overlapping chip blocks. Each stack holds a plurality of groups of vertically arranged electrodes with shifts in horizontal plane. A through hole is formed, for at least one of the groups, into the plurality of the chip layers at least in part so as to expose electrode surfaces of vertically arranged electrodes in the group. The through hole is filled with conductive material.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: April 27, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Takashi Hisada, Toyohiro Aoki, Eiji Nakamura
  • Patent number: 10956806
    Abstract: A computer-implemented method for efficient assembly of oligonucleotides for nucleic acid based data storage includes receiving encoded data including binary data encoded into nucleic acid sequence data, and assembling a target nucleic acid data strand based on the encoded data by, concatenating one or more selected codeword oligonucleotides obtained from a codeword stack strand.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Koji Masuda, Eiji Nakamura