Patents by Inventor Eiji Nukaga
Eiji Nukaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10833145Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: GrantFiled: January 17, 2019Date of Patent: November 10, 2020Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Patent number: 10681815Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: GrantFiled: February 26, 2019Date of Patent: June 9, 2020Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Koichi Niino, Eiji Nukaga, Keishi Watanabe
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Patent number: 10446302Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.Type: GrantFiled: November 15, 2016Date of Patent: October 15, 2019Assignee: ROHM CO., LTD.Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
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Publication number: 20190200458Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: ApplicationFiled: February 26, 2019Publication date: June 27, 2019Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
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Patent number: 10321570Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: GrantFiled: March 27, 2014Date of Patent: June 11, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Koichi Niino, Eiji Nukaga, Keishi Watanabe
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Publication number: 20190148480Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: ApplicationFiled: January 17, 2019Publication date: May 16, 2019Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
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Patent number: 10224391Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: GrantFiled: July 12, 2017Date of Patent: March 5, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Publication number: 20170365655Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: ApplicationFiled: July 12, 2017Publication date: December 21, 2017Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
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Patent number: 9735225Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: GrantFiled: December 2, 2015Date of Patent: August 15, 2017Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Publication number: 20170125143Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.Type: ApplicationFiled: November 15, 2016Publication date: May 4, 2017Applicant: ROHM CO., LTD.Inventors: Eiji NUKAGA, Hiroshi TAMAGAWA, Yasuhiro KONDO, Katsuya MATSUURA
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Patent number: 9530546Abstract: [Subject]To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor. [Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.Type: GrantFiled: December 18, 2012Date of Patent: December 27, 2016Assignee: ROHM CO., LTD.Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
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Publication number: 20160087027Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: ApplicationFiled: December 2, 2015Publication date: March 24, 2016Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
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Publication number: 20160050760Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: ApplicationFiled: March 27, 2014Publication date: February 18, 2016Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
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Patent number: 9224731Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. [Solution Means] A chip resistor 10 is arranged to have a resistor network 14 on a substrate. The resistor network 14 includes a plurality of resistor bodies R arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies R being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films C and fuse films F. By selectively fusing a fuse film F, a resistance unit can be electrically incorporated into the resistor network 14 or electrically separated from the resistor network to make the resistance value of the resistor network 14 the required resistance value.Type: GrantFiled: September 28, 2012Date of Patent: December 29, 2015Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Publication number: 20140354396Abstract: [Subject] To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor. [Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.Type: ApplicationFiled: December 18, 2012Publication date: December 4, 2014Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
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Publication number: 20140225220Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. [Solution Means] A chip resistor 10 is arranged to have a resistor network 14 on a substrate. The resistor network 14 includes a plurality of resistor bodies R arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies R being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films C and fuse films F. By selectively fusing a fuse film F, a resistance unit can be electrically incorporated into the resistor network 14 or electrically separated from the resistor network to make the resistance value of the resistor network 14 the required resistance value.Type: ApplicationFiled: September 28, 2012Publication date: August 14, 2014Applicant: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura