Abstract: A semiconductor device having a semiconductor chip that has a square main surface in which a plurality of elements are formed on the main surface of the chip, and in which first and second bonding pads are arranged along the periphery of the main surface. A plurality of first leads are provided in which the first and second ends thereof are positioned outside of the semiconductor chip. A second lead is also provided that extends on the main surface of the semiconductor chip and extends to the outside of the semiconductor chip. The device is additionally provided with electrical connections between the first bonding pads and the first ends of the first leads, second electrical connections between the second bonding pads and the second lead and a sealing material that covers the semiconductor chip, the first leads, a portion of the second lead, and the first and second electrical connections.