Abstract: A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimide compound represented by the following Formula (3), wherein the diamine component contains a diamine compound (a) in which m in the Formula (2) represents an integer of 0 or 1 and a diamine component (b) in which m in the Formula (2) represents an integer of 2 to 6 in a molar ratio (a:b) of from 100:0 to 50:50, wherein, in the Formula (2), when m is 2 or more, each X may be independently the same or different, and represents O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2 or a direct bond, wherein, in the Formula (3), n represents an integer of 0 to 6.

Abstract: Disclosed is a polyimide metal laminate having a metal layer with high adhesiveness. This polyimide metal laminate is suitable as a material for high-density circuit boards. Specifically disclosed is a polyimide film characterized by being surface-treated with an aqueous solution containing an alcohol amine and an alkali metal hydroxide. Also specifically disclosed is a polyimide metal laminate obtained by providing the surface of such a polyimide film with a thermoplastic polyimide and then forming a metal layer on the outer side of the thermoplastic polyimide layer. Further specifically disclosed is a method for manufacturing such a polyimide metal laminate.

Abstract: A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimide compound represented by the following Formula (3), wherein the diamine component contains a diamine compound (a) in which m in the Formula (2) represents an integer of 0 or 1 and a diamine component (b) in which m in the Formula (2) represents an integer of 2 to 6 in a molar ratio (a:b) of from 100:0 to 50:50, wherein, in the Formula (2), when m is 2 or more, each X may be independently the same or different, and represents O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2 or a direct bond, wherein, in the Formula (3), n represents an integer of 0 to 6.

Abstract: The present invention relates to a polyimide-metal laminate that ensures a high adhesion of a metal layer and suitable for use as a material of a high density circuit board. In particular, it provides a polyimide film characterized by having undergone a surface treatment with an alkaline aqueous solution containing a permanganate. The alkaline aqueous solution preferably contains a hydroxide. It also provides a polyimide-metal laminate characterized in that on a surface of the polyimide film a thermoplastic polyimide layer and a metal layer are formed, and a method of producing the polyimide-metal laminate.

Abstract: The polyimide metal laminate has at least one resin layer produced from a silica-dispersed polyimide composition obtained by reacting (A) alkoxysilane and/or its partial hydrolysis polycondensate with (B) an amino-containing compound having a functional group capable of forming a bond with silica, in the presence of water in a polyimide solution and/or a polyamic acid solution.

Abstract: The polyimide metal laminate has at least one resin layer produced from a silica-dispersed polyimide composition obtained by reacting (A) alkoxysilane and/or its partial hydrolysis polycondensate with (B) an amino-containing compound having a functional group capable of forming a bond with silica, in the presence of water in a polyimide solution and/or a polyamic acid solution.

Abstract: A heat resistance resin composition having superb low-temperature adhesiveness and a polyimide/metal laminate which is superior in solder heat resistance and hardly generates swelling when forming a Au—Sn bond or Au—Au bond, which are used for lead-free soldering and COF packaging.

Abstract: A method for forming a continuous material by connecting sheet materials which are used in various fields including the processing of metal foils, the processing of metal-plastic composite film material, and the processing of thermoplastic resin films such as polyimides, and an apparatus used for carrying out this method comprising a hot press, a material locking device and an accumulator. A continuous material can be formed by interposing a resin bonding layer between the trailing edge of a sheet material and the leading edge of another sheet material, and subjecting this part to thermocompression bonding.

Abstract: A treatment for reducing friction of seat belts which is characterized by containing therein a polyether polyester having an average molecular weight of 2000-15000 which is obtained from a polyether diol and an aliphatic carboxylic acid, and preferably further containing a silicone compound. This treatment can be applied to either seat belt yarns in the yarn-making step or to seat belt webbing. The resulting seat belt is superior in slip properties and retains them even after wear. It is also superior in retractiablity and wear resistance (durability).

Abstract: Synthetic peptides containing the following specific sequence:Xaa-Pro-Val-Xbb-Xcc-Lys-Arg-W (wherein Xaa is absent or represents Cys or Ser, Xbb represents His or Asn, Xcc represents Leu or Ile and W represents a hydrophobic peptide portion.), an intermediate for producing the peptide, a process for producing the peptide, a lung surfactant comprising the peptide and a lipid mixture and a remedy for respiratory distress syndrome containing the surfactant as the active ingredient. The peptide is easy to isolate and purify and suitable for mass production. As it is highly soluble in methanol and the like, it can readily be blended with a lipid mixture and is suited for the preparation of a lung surfactant. As the lung surfactant has a good supensibility and a potent surface activity, it is useful as a remedy for respiratory distress syndrome.