Patents by Inventor Eiji Oi

Eiji Oi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated electric motor and drive, optimized for high-temperature operation
    Patent number: 7199496
    Abstract: The heat-generating components of an integrated motor system are disposed proximate the motor body, for efficient heat dissipation, and the heat-sensitive components are segregated therefrom, physically and thermally.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: April 3, 2007
    Assignee: Oriental Motor Boston Technology Group Incorporated
    Inventors: Seiki Suzuki, Yasuo Sato, Akihiko Hoda, Chikara Sugawara, Yoshinari Araki, Eiji Oi, Hung D. Vu
  • Integrated electric motor and drive, optimized for high-temperature operation
    Publication number: 20060158049
    Abstract: The heat-generating components of an integrated motor system are disposed proximate the motor body, for efficient heat dissipation, and the heat-sensitive components are segregated therefrom, physically and thermally.
    Type: Application
    Filed: January 18, 2005
    Publication date: July 20, 2006
    Inventors: Seiki Suzuki, Yasuo Sato, Akihiko Hoda, Chikara Sugawara, Yoshinari Araki, Eiji Oi, Hung Vu
  • Semiconductor integrated circuit device
    Patent number: 6031257
    Abstract: In a CMOS gate array, each of bonding pads corresponding to input cells for signals and bonding pads corresponding to input cells for supply voltages is formed of a plurality of conductor layers, whereas each of bonding pads (non-connected pads) corresponding to input/output cells not to be used is formed of, for example, the uppermost conductor layer. Thus, the bonding pad (non-connected pad) corresponding to the input/output cell not to be used becomes greater in the thickness of an underlying insulator film and longer in its spacing from a semiconductor substrate in comparison with each of the bonding pad for the signal and the bonding pad for the supply voltage.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: February 29, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Takayuki Noto, Eiji Oi, Yahiro Shiotsuki, Kazuo Kato, Hideki Ohagi