Abstract: It is aimed to provide a power supply device and a power supply system which enable consumers to freely choose electrical power and specify transmission sources when receiving electrical power, and enable parties involved in transactions (power supply side and power receiving side) to reliably and safely perform transmission between them. There are provided a power supply device and a power supply system. The power supply device includes a baseband unit that generates a power signal, a modulation processing unit that modulates the power signal generated by the baseband unit to impart a code thereto for specifying a transmission source of the power signal and generates a modulated signal that can be demodulated by a power receiving device, and a transmission unit that transmits the modulated signal generated by the modulation processing unit.

Abstract: It is aimed to provide a power supply device and a power supply system which enable consumers to freely choose electrical power and specify transmission sources when receiving electrical power, and enable parties involved in transactions (power supply side and power receiving side) to reliably and safely perform transmission between them. There are provided a power supply device and a power supply system. The power supply device includes a baseband unit that generates a power signal, a modulation processing unit that modulates the power signal generated by the baseband unit to impart a code thereto for specifying a transmission source of the power signal and generates a modulated signal that can be demodulated by a power receiving device, and a transmission unit that transmits the modulated signal generated by the modulation processing unit.

Abstract: A metal film 21 is laminated directly to or by means of an adhesive 13 to a transparent base sheet 11. A mesh metal film including lines defining apertures is formed by coating the metal film 21 with a mesh resist layer 109a patterned in a mesh, etching the metal film 21 through the mesh resist layer 109a, and removing the mesh resist layer 109a. The front surfaces and side surfaces of the lines of the mesh metal film are coated with a black coating layer 23.

Abstract: An electromagnetic wave shielding sheet includes a transparent substrate 11 and a metal layer 15 provided on one surface of the transparent substrate 11 through an adhesive layer 13. The metal layer 15 includes a mesh part 103 and a frame part 101 surrounding the mesh part 103. The frame part 101 includes at least one transparent part 105 that is a metal-layer-free area. Preferably, the transparent part 105 includes a metallic portion 105a in a geometric pattern. Light transmitted by or reflected from the transparent part 105 is detected, thereby the transparent part 105 can be used as a register mark for detecting the position of the mesh part 103.

Abstract: An electromagnetic wave shielding sheet comprises a transparent substrate 11 and a metal layer 15 provided on one surface of the transparent substrate 11 through an adhesive layer 13. The metal layer 15 includes a mesh part 103 and a frame part 101 surrounding the mesh part 103. The frame part 101 includes at least one transparent part 105 that is a metal-layer-free area. Preferably, the transparent part 105 includes a metallic portion 105a in a geometric pattern. Light transmitted by or reflected from the transparent part 105 is detected, thereby the transparent part 105 can be used as a register mark for detecting the position of the mesh part 103.

Abstract: A display device includes a display panel having an electrooptic material provided between a pair of substrates opposed to each other. The display panel has a driver integrated circuit mounted on an extended area in which an edge of one of the substrates extends further than an edge of the other substrate. The extended area is provided in at least a margin of the display panel. A control circuit board is provided above the driver integrated circuit almost within the extended area. The control circuit board is connected to the input terminal portion of the driver integrated circuit.

Abstract: A metal film 21 is laminated directly to or by means of an adhesive 13 to a transparent base sheet 11. A mesh metal film including lines defining apertures is formed by coating the metal film 21 with a mesh resist layer 109a patterned in a mesh, etching the metal film 21 through the mesh resist layer 109a, and removing the mesh resist layer 109a. The front surfaces and side surfaces of the lines of the mesh metal film are coated with a black coating layer 23.

Abstract: A composite flexible wiring board comprises a first flexible wiring board and a second flexible wiring board on which a surface-mounted part is provided. The second flexible wiring board is disposed on the first flexible wiring board in its predetermined area. The first flexible wiring board and the second flexible wiring board are electrically connected to each other through an interlayer contact portion provided in a predetermined position. The first flexible wiring board has an input terminal region and an output terminal region with a power IC chip mounted on the first flexible wiring board.

Abstract: A first driver IC is mounted in the area which includes one side of the panel substrate on an electro-optical panel, and the edge portion of the film base material on which a second driver IC is mounted is bonded to the vicinity of the one side of the above-mentioned panel substrate. Also, driver-controlling electronic components which each provides control signals to the first and second driver ICs are mounted on the same surface as the second driver IC in the film base material.

Abstract: Connection terminals connected to a scanning driver IC chip 32 are arranged on a short side of a wiring connection area 25A of a second substrate 25 in a liquid crystal display panel 21, and the connection terminals and connection terminals arranged on a long side of a wiring connection area 24A of a first substrate 24 are connected from the same direction with a single flexible printed wiring board 22. For this reason, convenience of the flexible printed wiring board 22 can be improved. In addition, it is possible to reduce the projection size of the wiring connection area of the first substrate 24, and the ratio of the display area in the whole liquid crystal panel 21 can be increased.

Abstract: A first driver IC is mounted in the area which includes one side of the panel substrate on an electro-optical panel, and the edge portion of the film base material on which a second driver IC is mounted is bonded to the vicinity of the one side of the above-mentioned panel substrate. Also, driver-controlling electronic components which each provides control signals to the first and second driver ICs are mounted on the same surface as the second driver IC in the film base material.