Patents by Inventor Eiji Takaara

Eiji Takaara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7384875
    Abstract: In a method of manufacturing a semiconductor device, a flexible tube connects at least part of a path extending from a reaction chamber to a detoxification device through a vacuum pump. The flexible tube has a tube body made of hard material, the tube body having projected parts and depressed parts and a cover provided over an outer surface of the tube body, the cover being made of elastic material, the cover being in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover. Then, a semiconductor substrate is disposed within the reaction chamber. The vacuum pump is activated to bring the reaction chamber into a pressure-reduced state. A reaction gas is supplied to the reaction chamber. Finally, the reaction gas causes to react to thereby deposit a reactant on the semiconductor substrate.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: June 10, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Eiji Takaara
  • Publication number: 20050233592
    Abstract: In a method of manufacturing a semiconductor device, a flexible tube connects at least part of a path extending from a reaction chamber to a detoxification device through a vacuum pump. The flexible tube has a tube body made of hard material, the tube body having projected parts and depressed parts and a cover provided over an outer surface of the tube body, the cover being made of elastic material, the cover being in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover. Then, a semiconductor substrate is disposed within the reaction chamber. The vacuum pump is activated to bring the reaction chamber into a pressure-reduced state. A reaction gas is supplied to the reaction chamber. Finally, the reaction gas causes to react to thereby deposit a reactant on the semiconductor substrate.
    Type: Application
    Filed: June 3, 2005
    Publication date: October 20, 2005
    Inventor: Eiji Takaara
  • Patent number: 6919281
    Abstract: In a method of manufacturing a semiconductor device, a flexible tube connects at least part of a path extending from a reaction chamber to a detoxification device through a vacuum pump. The flexible tube has a tube body made of hard material, the tube body having projected parts and depressed parts and a cover provided over an outer surface of the tube body, the cover being made of elastic material, the cover being in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover. Then, a semiconductor substrate is disposed within the reaction chamber. The vacuum pump is activated to bring the reaction chamber into a pressure-reduced state. A reaction gas is supplied to the reaction chamber. Finally, the reaction gas causes to react to thereby deposit a reactant on the semiconductor substrate.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: July 19, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Eiji Takaara
  • Publication number: 20040072449
    Abstract: In a method of manufacturing a semiconductor device, a flexible tube connects at least part of a path extending from a reaction chamber to a detoxification device through a vacuum pump. The flexible tube has a tube body made of hard material, the tube body having projected parts and depressed parts and a cover provided over an outer surface of the tube body, the cover being made of elastic material, the cover being in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover. Then, a semiconductor substrate is disposed within the reaction chamber. The vacuum pump is activated to bring the reaction chamber into a pressure-reduced state. A reaction gas is supplied to the reaction chamber. Finally, the reaction gas causes to react to thereby deposit a reactant on the semiconductor substrate.
    Type: Application
    Filed: July 29, 2003
    Publication date: April 15, 2004
    Inventor: Eiji Takaara
  • Patent number: 6681808
    Abstract: A flexible tube for a vacuum system includes a tube body and a cover. The tube body is made of hard material. The tube body has projected parts and depressed parts. The cover is provided over an outer surface of the tube body. The cover is made of elastic material. The cover may be in contact with the projected parts of the tube body and extend over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: January 27, 2004
    Assignee: Oki Electric Industry Co, Ltd.
    Inventor: Eiji Takaara
  • Publication number: 20030172980
    Abstract: A flexible tube for a vacuum system includes a tube body and a cover. The tube body is made of hard material. The tube body has projected parts and depressed parts. The cover is provided over an outer surface of the tube body. The cover is made of elastic material. The cover is in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover.
    Type: Application
    Filed: January 16, 2003
    Publication date: September 18, 2003
    Inventor: Eiji Takaara