Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: The present invention provides an improvement in the process of producing pitch-based carbon fibers comprising the steps of spinning a spinnable pitch, treating the resulting pitch fibers for rendering infusible, and carbonizing the same, the improvement comprises the step of removing the surface layer from the carbon fibers obtained in said process.

Abstract: A process for preparing pitch-type carbon fibers by melt-spinning a pitch-type material, rendering the material infusible and carbonizing it, characterized by the steps of passing molten pitch, before reaching the final nozzle, through a capillary portion of circular, otherwise shaped, or slit type to thereby apply a shearing stress at least 1/2 as high as the level of shearing stress to be exerted during the passage through the final nozzle orifice, maintaining the molten pitch in a state substantially free of shearing stress and then passing the pitch through the nozzle orifice for spinning.

Abstract: A process for preparing a carbon fiber having an elliptical cross section, characterized by the steps of extruding spinnable pitch from a nozzle with an orifice rectangular or otherwise shaped in cross section and having a width/height ratio of more than 1, fully relaxing the molecules orientated by the nozzle on discharge from the nozzle, effecting continuous winding-up to obtain a pitch fiber elliptical in cross section, rendering the fiber infusible and carbonizing the same.