Abstract: A method of manufacturing a glass substrate with buried through electrodes comprises forming via-holes in each of two base panels and in a glass panel interposed between the base panels so that the via-holes are aligned with one another. Conductive wires are penetrated through the aligned via-holes and stretched between the base panels. The first panel is subjected to compression stress and is heated to a temperature higher than a softening point of the glass material so that the stretched conductive wires are buried in the glass material. The first panel is then cooled to form a glass ingot having the buried conductive wires. The glass ingot is sliced to form a glass panel, and the glass panel is polished to expose the buried conductive wires on front and rear surfaces of the glass panel to form a glass substrate with buried through electrodes.

Abstract: Disclosed is a method of manufacturing a glass substrate with through electrodes, the method including: a wire stretching process in which a plurality of conductive wires are stretched in parallel between upper and lower bases; a wire burying process in which a plurality of the wires between the bases are buried by glass; an ingot formation process in which a glass ingot having the buried wires is formed by cooling the glass; a slicing process in which a glass panel is formed by slicing the glass ingot; and a polishing process in which a plurality of the wires are exposed on front and rear surfaces of the glass panel to provide the through electrodes.

Abstract: A plurality of via-holes are formed in panel-shaped glass, and a plurality of via-holes are formed in two bases. Then, the panel-shaped glass is interposed between the two bases, positions of a plurality of the via-holes of the bases and a plurality of the via-holes of the panel-shaped glass are aligned, wires made of a conductive material are penetrated, and the wires between the two bases are stretched. Then, the panel-shaped glass is heated to a point higher than a softening point of the glass, the wires between the bases are buried by the glass, and the glass is cooled to form a glass ingot having the buried wires. Then, the ingot is sliced to form a glass substrate, the glass panel is polished to expose the wires on front and rear surfaces as the through electrodes.